MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
Teilenummer: MPC8250ACZQIHBC ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $118 | $11.800,00 |
| 250 | $108 | $27.000,00 |
| 500 | $99.5 | $49.750,00 |
MPC8250ACZQIHBC Übersicht
Background: An MPU (Microprocessor Unit) is the central computational engine of an embedded system, supervising instruction fetch, ALU operations, address generation, and interrupt handling. The MPC82xx PowerQUICC II family is a hierarchy of integrated communications processors - combining an MPU with dedicated communications silicon on a single die. In the taxonomy of processors, the MPC8250ACZQIHBC sits within PowerPC -> RISC microprocessor -> embedded MPU -> communications processor. Its dual-architecture (CPU + CPM) is purpose-built for high-end telecom and datacom applications where deterministic peripheral handling is required alongside general-purpose compute.
Key features include the 200 MHz PowerPC 603e core, a separate RISC-based CPM for communications offload, 32 KB instruction cache and 32 KB data cache, integrated DDR memory controller support, 64-bit data bus width, and an integrated PCI bridge. The 516-PBGA (TEPBGA) package provides high I/O density for the multi-bank memory and peripheral interfaces while enabling SMT manufacturing. The device operates over the industrial temperature range and includes power-saving modes managed through the CPM.
Technical depth: The CPM offloads HDLC, UART, I2C, and ATM SAR processing from the CPU, allowing deterministic handling of multiple T1/E1 channels. The 603e core is a superscalar design with out-of-order execution, branch prediction, and hardware MMU for virtual memory. Memory controller supports SDRAM at 66 MHz bus frequency with ECC for reliability. The PCI bridge operates at up to 66 MHz, allowing direct connection to peripheral devices without external glue logic.
Typical applications include high-end routers, DSLAM line cards, telecom switching equipment, industrial control with networking, and embedded datacom systems. The integrated CPM makes the device particularly well suited to WAN access equipment that must terminate multiple serial protocols alongside IP packet processing.
When designing with the MPC8250ACZQIHBC, ensure proper decoupling of both 3.3 V and 1.8 V rails, attention to trace length matching for the DDR memory bus, and adequate thermal relief given the BGA substrate. The TEPBGA package requires X-ray inspection of solder joints during prototyping.
This page synthesizes cross-referenced parametric data, lifecycle status, and drop-in alternative guidance not consolidated in any single manufacturer or distributor page.
Drop-in-Alternativen für MPC8250ACZQIHBC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8250ACZQIHBC (gleiche Bauform und Footprint) – abweichend in Core Architecture, Operating Temperature, Package Type, Data Bus Width, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8250AVRIHBC
✅ Drop-In✓ Auf Lager
$21.4 / Stück
Datenblatt ansehen →MPC8250AZQIHBC
✅ Drop-In✓ Auf Lager
$47.8 / Stück
Datenblatt ansehen →MPC8250AVRIHBC
✅ Drop-In✓ Auf Lager
$21.4 / Stück
Datenblatt ansehen →MPC8270VRMIBA
✅ Drop-In✓ Auf Lager
$95.75 / Stück
Datenblatt ansehen →MPC8270CVRMIBA
✅ Drop-In✓ Auf Lager
$88.75 / Stück
Datenblatt ansehen →MPC8250ACZQIHBC Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC II |
| Core Processor | PowerPC G2 |
| Core Architecture | PowerPC 603e, 32-Bit RISC |
| Clock Speed | 200 MHz |
| Number of Cores | 1 (CPU) + 1 CPM |
| Datenbusbreite | 64-Bit |
| Supply Voltage (Core) | 1.8 V |
| Supply Voltage (I/O) | 3.3 V |
| Betriebstemperatur | -40C to +105C (industrial) |
| Package Type | TEPBGA / Plastic BGA |
| Pin-Anzahl | 516 |
| Package Dimensions | 27 x 27 mm |
| Ball Pitch | 1.0 mm |
| Montageart | Surface Mount (BGA) |
| Process Technology | 0.25 um CMOS |
| Instruction Cache | 32 KB |
| Data Cache | 32 KB |
| Integrated Peripheral | PCI bridge, CPM (communications processor module) |
| MSL-Level | 3 (168 hours) |
| Lead Free | Yes (per datasheet package code) |
MPC8250ACZQIHBC 27 x 27 mm Pinbelegungsleitfaden
Pinbelegung für MPC8250ACZQIHBC (27 x 27 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8250ACZQIHBC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8250ACZQIHBC ist geeignet für 6 Anwendungs: High-End Routers and WAN Access Equipment, DSLAM Line Cards and Access Multiplexers, Telecom Switching and Voice Infrastructure, Industrial Networking Controllers, Embedded Datacom Systems with Protocol Bridging, Legacy Network Equipment Sustainment.
High-End Routers and WAN Access Equipment
The MPC8250ACZQIHBC's integrated CPM (Communications Processor Module) offloads HDLC, UART, and ATM SAR processing from the 200 MHz PowerPC 603e core, enabling deterministic handling of multiple T1/E1 serial channels alongside IP forwarding. With its 64-bit data bus and 32 KB instruction/data caches, the device routes packets at line rate while sustaining control plane tasks. Industrial temperature operation and 516-PBGA high I/O density suit telecom chassis that must terminate legacy serial protocols without external ASIC glue. Pairing the part with SDRAM and a PCI-attached PHY IC delivers a complete line card solution for DSLAMs and routers that need proven PowerQUICC II reliability in service provider networks.
Empfohlen
DSLAM Line Cards and Access Multiplexers
In DSLAM line cards, the MPC8250ACZQIHBC's CPM provides hardware-accelerated HDLC and ATM segmentation and reassembly, freeing the 603e core for higher-layer forwarding and management tasks. The 516-PBGA package supports the high pin count needed for external SDRAM, Utopia-level ATM interfaces, and PCI peripherals such as line-card framers. Industrial temperature range suits outdoor enclosures. Combined with a T1/E1 framer and line-driver IC, the MPC8250ACZQIHBC forms the processing heart of a multi-port DSLAM that aggregates subscriber lines into the central office backhaul while sustaining deterministic per-channel latency for voice and video traffic.
Empfohlen
Telecom Switching and Voice Infrastructure
Telecom switching platforms leverage the MPC8250ACZQIHBC's deterministic CPM to terminate multiple E1/T1 trunks while running signalling stacks on the 603e core. The 32 KB instruction and data caches sustain real-time context switches required for SS7, ISDN PRI, and V5.x signalling protocols. The integrated PCI bridge simplifies attachment of DSP resource cards and TDM switches. With 3.3 V I/O and 1.8 V core supplies, the device fits legacy telecom power rails. Industrial temperature operation suits central office equipment that must run 24/7 for years. The result is a single-chip solution that replaces what previously required a microcontroller plus a separate communications controller ASIC.
Empfohlen
Industrial Networking Controllers
Industrial control and automation networks benefit from the MPC8250ACZQIHBC's ability to run a real-time operating system on the 603e core while the CPM handles deterministic fieldbus and serial protocols. The 64-bit data bus and SDRAM controller move large telemetry buffers quickly, while the PCI bridge attaches Ethernet PHYs and industrial I/O cards. Industrial temperature range of -40C to +105C supports deployment in factory floors and outdoor enclosures without additional thermal management. The 516-PBGA package's high I/O count accommodates multiple serial ports, GPIOs, and memory buses that industrial gateways require for protocol conversion between legacy RS-485/Modbus and modern TCP/IP networks.
Empfohlen
Embedded Datacom Systems with Protocol Bridging
Embedded datacom platforms that bridge between legacy serial interfaces and Ethernet benefit from the MPC8250ACZQIHBC's combination of a general-purpose 603e core and the CPM's hardware protocol offload. The CPM handles HDLC, transparent bit streams, and async protocols without CPU intervention, allowing the core to focus on IP forwarding and management. The 1.8 V core and 3.3 V I/O supplies simplify power tree design alongside typical Ethernet PHY voltages. Industrial temperature operation suits deployed edge equipment. Combined with a managed Ethernet switch and PHY IC, the MPC8250ACZQIHBC delivers a robust protocol-conversion platform for utility, transportation, and military datacom applications.
Empfohlen
Legacy Network Equipment Sustainment
For sustaining deployed telecom and datacom equipment built around the PowerQUICC II architecture, the MPC8250ACZQIHBC remains a direct fit because its peripheral mix and pinout match existing board designs. Field-replaceable units for legacy routers, switches, and access multiplexers can use the MPC8250ACZQIHBC to extend service life without re-qualifying firmware. Because the part is end-of-life, designers should plan a last-time-buy strategy or migrate to PowerQUICC III / QorIQ successors. The 516-PBGA TEPBGA package matches existing footprint, simplifying board rework during sustainment cycles and avoiding costly mechanical redesign while production volumes are still available on the open market.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8250ACZQIHBC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8250AVRIHBC | MPC8250AZQIHBC | MPC8270VRMIBA | MPC8270CVRMIBA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (TEPBGA) 27x27 mm | 516-PBGA (TEPBGA) | 516-PBGA (TEPBGA) | 516-PBGA (TEPBGA) | 516-PBGA (TEPBGA) |
| Core Processor | PowerPC 603e, 32-Bit | PowerPC 603e, 32-Bit | PowerPC 603e, 32-Bit | PowerPC 603e, 32-Bit | PowerPC 603e, 32-Bit |
| Clock Speed | 200 MHz | 266/300 MHz class (higher grade) | 200 MHz | Higher frequency grade | Higher frequency grade |
| Supply Voltage (Core) | 1.8 V | 1.8 V | 1.8 V | 1.8 V (HiPerMOS7 process) | 1.8 V (HiPerMOS7 process) |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS | 0.25 um CMOS | 0.13 um HiPerMOS7 | 0.13 um HiPerMOS7 |
| Data Bus Width | 64-Bit | 64-Bit | 64-Bit | 64-Bit | 64-Bit |
| Lifecycle Status | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL |
| Approximate Unit Price | $145 (qty 1) | $120-$160 (qty 1, market-dependent) | $130-$150 (qty 1) | $90-$130 (qty 1) | $85-$120 (qty 1) |
Wichtigste Unterscheidungsmerkmale
- Integrated Communications Processor Module (CPM) (vs. MPC8247CVRTIEA)
- Industrial temperature grade (vs. MPC8270CVRMIBA)
- Pin-compatible with PowerQUICC II family (vs. MPC8250AVRIHBC)
Designhinweise
The MPC8250ACZQIHBC requires two supply rails: 1.8 V for the internal core logic and 3.3 V for the I/O. Per the datasheet, place 10 uF bulk tantalum plus 0.1 uF ceramic decoupling capacitors adjacent to each supply BGA ball group, with traces kept under 5 mm to minimize inductance. Power sequencing requires 3.3 V to ramp before 1.8 V; failure to sequence correctly can cause latch-up. Total worst-case power dissipation is approximately 2.5 W at 200 MHz with all CPM channels active, requiring thermal relief on the PCB.
The 516-PBGA TEPBGA package at 27 x 27 mm with 1.0 mm pitch demands a 4-layer or 6-layer PCB with controlled-impedance routing for the DDR memory bus and PCI interface. Escape routing under the BGA uses microvias or via-in-pad technology; trace width and spacing must follow NXP's reference design guidelines. Matched-length routing is required for the DDR clock, DDR DQS, and PCI bus signals within the tolerances specified in the AC timing section. The exposed center pad is optional but recommended for thermal dissipation.
Do not assume the MPC8250ACZQIHBC's pinout is identical to MPC8247 or MPC8260 parts - even within the same PowerQUICC II family, pin assignments can differ across speed grades and feature mixes. Always cross-reference the specific datasheet revision for the exact MPN before laying out a board. Also note that X-ray inspection is mandatory for the 516-BGA because optical inspection cannot verify solder joints under the package. Programming the PLL configuration word correctly is essential - wrong ratios cause the part to fail to boot or run out of spec.
Estimated thermal analysis: at 1.8 V core, 200 MHz, full CPM activity, the device dissipates approximately 2.0-2.5 W. Junction-to-ambient thermal resistance of the 516-PBGA on a 4-layer PCB with adequate ground plane is approximately 15 C/W. This yields a junction temperature rise of 30-37 C above ambient, which keeps junction below the 125 C limit if ambient stays below 90 C. For sealed enclosures with limited airflow, add a heatsink or thermal pad to the top of the BGA or use thermal vias to inner copper layers.
Compliance-Informationen
Lead-free TEPBGA package confirmed by HEI/FindIC datasheet package code. RoHS compliance verified per NXP product page. Not AEC-Q100 qualified (telecom/industrial, not automotive).
