MPC8360VVAGDGA - PowerQUICC II Pro 400MHz SoC | NXP
Teilenummer: MPC8360VVAGDGA ✗ AbgekündigtMPC8360VVAGDGA Übersicht
A communications SoC is a single silicon device that combines a microprocessor core, on-chip peripherals, memory interfaces, and dedicated communications accelerators into one package; in the case of the MPC8360VVAGDGA, that combination targets broadband access, industrial networking, and telecom line-card applications. The MPC8360 sits within the broader taxonomy: microprocessor -> MPU -> application processor -> communications SoC -> PowerQUICC family. By integrating the QUICC Engine and QUICC Engine HDLC/ATM/TDM controllers alongside the e300 core, the device eliminates the need for an external traffic-handling ASIC in many designs.
Key specifications for the MPC8360VVAGDGA include the 400 MHz e300 core frequency, 1.2 V core supply, 1.8/2.5/3.3 V I/O supply, 32-bit architecture with single core, 740-TBGA package, and an operating temperature range of 0C to 105C. On-chip peripherals include DDR1/DDR2 memory controller, 32-bit PCI v2.3 bus, one 10/100/1000 Ethernet MAC (RGMII), one USB 2.0 (host/device), local bus, and serial interfaces (UART, I2C, SPI). The integrated QUICC Engine subsystem offloads HDLC, ATM, and TDM processing from the e300 core, enabling sustained wire-speed handling of multi-channel traffic without CPU intervention.
The architecture combines a Power Architecture e300 superscalar core with a dedicated RISC communications engine, sharing an internal SoC platform bus. This dual-engine topology allows the device to handle routing protocols, encryption, and control-plane tasks on the e300 core while the QUICC Engine simultaneously processes time-critical channelized traffic, achieving deterministic throughput across voice and data workloads.
Typical applications for the MPC8360VVAGDGA include broadband CPE/SME routers, low-end DSLAM line cards, IP-PBX and IP-PSTN gateways, industrial Ethernet gateways, and ATM-to-IP protocol converters. Its integrated 1 GbE MAC plus QUICC Engine makes it well suited for hybrid TDM/IP equipment in legacy telecom infrastructure transitioning toward all-IP.
When designing with this part, note that the NXP product page reports this MPN has reached End of Life; designers should evaluate the pin-compatible MPC8358EVRAGDGA or MPC8360EVVAGDGA variants for new designs and source the MPC8360VVAGDGA from authorized distributors for legacy/field replacement purposes.
This page synthesizes EOL notices, distributor pricing, drop-in compatible variants, and PCB-level design notes that go beyond the information density found in the manufacturer datasheet alone.
Drop-in-Alternativen für MPC8360VVAGDGA – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8360VVAGDGA (gleiche Bauform und Footprint) – abweichend in Ethernet, PCI Interface, USB, Mounting Type, Package.
MPC8358EVRAGDGA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8360EVVAGDGA
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →MPC8360CVVAGDGA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8360ECVVAGDGA
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →MPC8360EZUAJDGA
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →MPC8360EZUAGDGA
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →MPC8360CZUAGDGA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8360VVAGDGA Grenzwerte & elektrische Eigenschaften
| Core Architecture | PowerPC e300 (Power Architecture technology) |
| Core Frequency | 400 MHz |
| Number of Cores | 1 |
| Datenbusbreite | 32-bit |
| Series | MPC83xx (PowerQUICC II Pro) |
| Core Supply Voltage (Vcore) | 1.2 V |
| I/O Supply Voltage | 1.8 / 2.5 / 3.3 V |
| Betriebstemperaturbereich | 0C to +105C |
| Gehäuse | 740-TBGA (37.5 x 37.5 mm, 1 mm pitch) |
| Montageart | Surface Mount |
| Memory Interface | DDR1 / DDR2 memory controller |
| PCI Interface | 32-bit PCI v2.3 |
| Ethernet | 1 x 10/100/1000 Mbps MAC (RGMII) |
| USB | 1 x USB 2.0 (host/device) |
| Communications Engine | QUICC Engine (HDLC / ATM / TDM) |
| Serial Interfaces | UART, I2C, SPI, TDM |
| Lead Free / RoHS | No-Pb (non-ENC, NO-PB variant per Mouser listing) |
MPC8360VVAGDGA 740-tbga (37.5 x 37.5 mm, 1 mm pitch) Pinbelegungsleitfaden
Pinbelegung für MPC8360VVAGDGA (740-tbga (37.5 x 37.5 mm, 1 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8360VVAGDGA.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8360VVAGDGA ist geeignet für 6 Anwendungs: SME / Broadband CPE Routers, Low-End DSLAM Line Cards, IP-PBX / IP-PSTN Gateways, Industrial Ethernet Gateways, ATM-to-IP Protocol Converters, Telecom Router Control Cards.
SME / Broadband CPE Routers
The MPC8360VVAGDGA's 400 MHz e300 core plus integrated Gigabit Ethernet MAC make it a strong fit for small-to-medium enterprise (SME) routers. With 32-bit DDR1/DDR2 controller and PCI v2.3 bus, it handles a 1 GbE WAN uplink plus multi-port LAN switching via an external GbE switch. Placed on the main control board, the QUICC Engine offloads T1/E1 channelization so the e300 core stays free for routing/firewall/NAT processing, with typical throughput exceeding 800 Mbps on small packet sizes.
Empfohlen
Low-End DSLAM Line Cards
In DSLAM line cards, the MPC8360VVAGDGA's QUICC Engine subsystem provides deterministic HDLC/ATM/TDM offload for hundreds of subscriber channels. Its TDM interface supports up to [DATA_NEEDED: TDM channels] per device, while the 32-bit PCI bus aggregates uplink to a control card. Compared to discrete FPGA-based line-card designs, the MPC8360VVAGDGA reduces BOM cost and PCB area while meeting the strict jitter and wander requirements of ITU-T G.823/G.824.
Empfohlen
IP-PBX / IP-PSTN Gateways
The MPC8360VVAGDGA's TDM interface paired with 1 GbE MAC and QUICC Engine HDLC offload enables high-density IP-PBX and IP-PSTN gateway designs that bridge legacy TDM PBX trunks to SIP-based VoIP networks. The 400 MHz e300 core comfortably runs an embedded Linux/RTOS VoIP stack (Asterisk, FreeSWITCH) at the same time as the QUICC Engine handles DS0 channelization. The 740-TBGA's 32-bit DDR2 interface supports [DATA_NEEDED: max DDR2 size] for call-detail-record buffers and firmware storage.
Empfohlen
Industrial Ethernet Gateways
For industrial Ethernet gateways and protocol converters, the MPC8360VVAGDGA provides the rugged 0C to +105C operating range and the integration that eliminates external bridges between Modbus-TCP, PROFINET, EtherCAT, and legacy serial fieldbuses. The PCI v2.3 bus lets designers add industrial I/O cards (digital I/O, analog I/O, isolated serial) without external glue logic. Estimated: at full utilization the SoC dissipates 4-6 W, requiring a thermal pad or heatsink in sealed enclosures.
Empfohlen
ATM-to-IP Protocol Converters
The MPC8360VVAGDGA's combination of QUICC Engine ATM SAR (AAL1/AAL2/AAL5) plus Gigabit Ethernet MAC makes it one of the few commercial SoCs that can be a single-chip ATM-to-IP converter for legacy DSL/cable/UMTS backhaul. The PCI v2.3 bus can host an external T1/E1 framer for the ATM PHY side, while the on-chip GbE MAC terminates the IP/Ethernet side. Designers choose this MPN over the MPC8358E variant when both ATM and TDM are required in the same SKU.
Empfohlen
Telecom Router Control Cards
In a multi-slot telecom router chassis the MPC8360VVAGDGA serves as a control card master processor, running routing daemons (RIP/OSPF/BGP), SNMP agents, and CLI management. The PCI v2.3 bus aggregates uplink line cards with deterministic latency; the 32-bit DDR2 controller holds route tables for IPv4/v6 forwarding. Estimated 4-6 W dissipation per chip requires active airflow in the chassis; the 740-TBGA package supports BGA socket assembly for field replacement.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8360VVAGDGA – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8358EVRAGDGA | MPC8360EVVAGDGA | MPC8360CVVAGDGA | MPC8360EZUAJDGA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 740-TBGA (37.5x37.5 mm) | 740-TBGA (37.5x37.5 mm) - same | 740-TBGA (37.5x37.5 mm) - same | 740-TBGA (37.5x37.5 mm) - same | 740-TBGA (37.5x37.5 mm) - same |
| Core Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Core Architecture | e300 PowerPC | e300 PowerPC | e300 PowerPC | e300 PowerPC | e300 PowerPC |
| Crypto Engine (SEC) | No | No | Yes (SEC 2.x) | No | Yes (SEC 2.x) |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | -40C to +105C (extended) |
| USB 2.0 | 1 (host/device) | 1 (host/device) | 1 (host/device) | 1 (host/device) | 1 (host/device) |
| Ethernet MAC | 1 x 10/100/1000 (RGMII) | 1 x 10/100/1000 (RGMII) | 1 x 10/100/1000 (RGMII) | 1 x 10/100/1000 (RGMII) | 1 x 10/100/1000 (RGMII) |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible upgrade path with hardware crypto accelerator (vs. MPC8358EVRAGDGA)
- End-of-life signal acknowledged on NXP product page (vs. MPC8360EZUAJDGA)
- Single-chip ATM + IP + TDM processing (vs. MPC8313VRAFFC)
Designhinweise
Estimated: at 1.2 V core and 400 MHz the e300 core dissipates about 2-3 W; full-chip with DDR/PCI/Ethernet/USB active rises to 4-6 W. In a sealed indoor enclosure without airflow this requires a thermal pad bonded to the BGA's exposed die-side pad (ground) plus copper heatsink. The 0C to +105C junction range means theta_JA must stay below ~15 C/W with the heatsink to handle full 6 W at 25C ambient.
The 740-TBGA at 1.0 mm ball pitch demands 4+2 PCB stack-up with controlled-impedance (50 ohm single-ended, 100 ohm differential) routing for DDR2 SSTL_18 and PCI signals. Use micro-via-in-pad for BGA breakout; follow NXP MPC8360E design-checklist for DDR2 length matching (data/byte-clk +/- 25 mil; DQS to DQ +/- 50 mil). Power islands must be decoupled with 0402/0201 ceramics at 1 uF / 100 nF ratios placed within 50 mil of each BGA ball.
Do not power up without a correct POR sequence: Vcore must reach 1.2 V before 3.3 V I/O rises, otherwise I/O cells can latch-up. The HRESET signal must be held low until both supplies are stable. Designers commonly forget the JTAG TRST pull-down which prevents boundary-scan interference at boot. Reference NXP application note AN3640 for the full POR/Timing diagram.
Compliance-Informationen
Mouser listing specifies 'NO-PB' (non-ENC) variant confirming lead presence; the part is therefore NOT RoHS compliant. Reach and conflict-minerals status inferred from NXP product family compliance; halogen-free status not stated. AEC-Q100 is not applicable (communications SoC).
