MPC8360ZUAJDGA vs MPC8360EVVAGDGA Vergleich
Detaillierter Direktvergleich von MPC8360ZUAJDGA von NXP Semiconductors und MPC8360EVVAGDGA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8360ZUAJDGA - PowerQUICC II Pro MPU, 533MHz e300, 740-TBGA | NXP
MPC8360ZUAJDGA ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC8360ZUAJDGA | MPC8360EVVAGDGA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | PowerQUICC II Pro, MPC83xx | PowerQUICC II Pro (MPC8360E family) |
| Core Processor | PowerPC e300 | — |
| Core Architecture | Power Architecture, 32-bit | — |
| Number of Cores | 1 | 1 |
| Core Clock Speed | 533 MHz | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Process Technology | 0.13 micron CMOS | — |
| Gehäuse | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA (37.5 x 37.5 mm) |
| Montageart | Surface Mount (T-BGA) | Surface Mount (TBGA ball grid) |
| Memory Controller | DDR1 / DDR2 with ECC | DDR1/DDR2 SDRAM with ECC |
| Ethernet | 10/100/1 GbE (GMII/RGMII) | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) | PCI 2.2 (32-bit, 66 MHz) / PCI-X |
| USB Interface | USB 2.0 (host/device) | — |
| Serial Interfaces | TDM, ATM, HDLC (QUICC Engine) | — |
| Supply Voltage Rails | 1.8 V / 2.5 V / 3.3 V | — |
| Betriebstemperatur | 0 C to +105 C | — |
| Encryption | Non-encryption (no SEC) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Core | — | Power Architecture e300 (enhanced MPC603e) |
| Datenbusbreite | — | 32-bit |
| Maximale Taktfrequenz | — | 400 MHz |
| Operating Core Voltage | — | 1.2 V |
| I/O Voltage | — | 3.3 V |
| Security Engine | — | SEC (IPSEC/SSL/SRNG) |
| USB | — | USB 2.0 |
| TDM / H.110 | — | Yes |
| ATM Support | — | Yes (ATM SAR, AAL) |
| Betriebstemperaturbereich | — | 0C to +105C (TA) |
| Lead-Free | — | Yes (per distributor listing, Mouser 'NO-PB' coding) |
| Revision | — | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced |
| Packaging | — | Tray |
| ECCN | — | 5A002.a.1 |