MPC8360ZUAJDGA vs MPC8360EVVAGDGA 比較
詳細な並列比較: MPC8360ZUAJDGA メーカー: NXP Semiconductors および MPC8360EVVAGDGA メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
NXP Semiconductors
MPC8360ZUAJDGA - PowerQUICC II Pro MPU, 533MHz e300, 740-TBGA | NXP
MPC8360ZUAJDGA ⚠ ラストタイムバイNXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ ラストタイムバイ仕様比較
| パラメータ | MPC8360ZUAJDGA | MPC8360EVVAGDGA |
|---|---|---|
| ブランド | NXP Semiconductors | NXP Semiconductors |
| カテゴリ | Microcontrollers | Microcontrollers |
| ライフサイクル状態 | ラストバイ | ラストバイ |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | PowerQUICC II Pro, MPC83xx | PowerQUICC II Pro (MPC8360E family) |
| Core Processor | PowerPC e300 | — |
| Core Architecture | Power Architecture, 32-bit | — |
| Number of Cores | 1 | 1 |
| Core Clock Speed | 533 MHz | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Process Technology | 0.13 micron CMOS | — |
| パッケージ | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA (37.5 x 37.5 mm) |
| 実装タイプ | Surface Mount (T-BGA) | Surface Mount (TBGA ball grid) |
| Memory Controller | DDR1 / DDR2 with ECC | DDR1/DDR2 SDRAM with ECC |
| Ethernet | 10/100/1 GbE (GMII/RGMII) | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) | PCI 2.2 (32-bit, 66 MHz) / PCI-X |
| USB Interface | USB 2.0 (host/device) | — |
| Serial Interfaces | TDM, ATM, HDLC (QUICC Engine) | — |
| Supply Voltage Rails | 1.8 V / 2.5 V / 3.3 V | — |
| 動作温度 | 0 C to +105 C | — |
| Encryption | Non-encryption (no SEC) | — |
| RoHS ステータス | [DATA_NEEDED: RoHS status] | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] |
| MSLレベル | [DATA_NEEDED: MSL level] | — |
| Core | — | Power Architecture e300 (enhanced MPC603e) |
| データバス幅 | — | 32-bit |
| 最大クロック周波数 | — | 400 MHz |
| Operating Core Voltage | — | 1.2 V |
| I/O Voltage | — | 3.3 V |
| Security Engine | — | SEC (IPSEC/SSL/SRNG) |
| USB | — | USB 2.0 |
| TDM / H.110 | — | Yes |
| ATM Support | — | Yes (ATM SAR, AAL) |
| 動作温度範囲 | — | 0C to +105C (TA) |
| Lead-Free | — | Yes (per distributor listing, Mouser 'NO-PB' coding) |
| Revision | — | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced |
| Packaging | — | Tray |
| ECCN | — | 5A002.a.1 |