MPC8360ZUAJDGA vs MPC8360EVVAGDGA Comparaison
Comparaison détaillée côte à côte de MPC8360ZUAJDGA par NXP Semiconductors et MPC8360EVVAGDGA par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8360ZUAJDGA - PowerQUICC II Pro MPU, 533MHz e300, 740-TBGA | NXP
MPC8360ZUAJDGA ⚠ Dernier achatNXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Dernier achatComparaison des spécifications
| Paramètre | MPC8360ZUAJDGA | MPC8360EVVAGDGA |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | Dernier achat |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | PowerQUICC II Pro, MPC83xx | PowerQUICC II Pro (MPC8360E family) |
| Core Processor | PowerPC e300 | — |
| Core Architecture | Power Architecture, 32-bit | — |
| Number of Cores | 1 | 1 |
| Core Clock Speed | 533 MHz | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Process Technology | 0.13 micron CMOS | — |
| Boîtier | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA (37.5 x 37.5 mm) |
| Type de montage | Surface Mount (T-BGA) | Surface Mount (TBGA ball grid) |
| Memory Controller | DDR1 / DDR2 with ECC | DDR1/DDR2 SDRAM with ECC |
| Ethernet | 10/100/1 GbE (GMII/RGMII) | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) | PCI 2.2 (32-bit, 66 MHz) / PCI-X |
| USB Interface | USB 2.0 (host/device) | — |
| Serial Interfaces | TDM, ATM, HDLC (QUICC Engine) | — |
| Supply Voltage Rails | 1.8 V / 2.5 V / 3.3 V | — |
| Température de fonctionnement | 0 C to +105 C | — |
| Encryption | Non-encryption (no SEC) | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Core | — | Power Architecture e300 (enhanced MPC603e) |
| Largeur du bus de données | — | 32-bit |
| Fréquence d'horloge maximale | — | 400 MHz |
| Operating Core Voltage | — | 1.2 V |
| I/O Voltage | — | 3.3 V |
| Security Engine | — | SEC (IPSEC/SSL/SRNG) |
| USB | — | USB 2.0 |
| TDM / H.110 | — | Yes |
| ATM Support | — | Yes (ATM SAR, AAL) |
| Plage de température de fonctionnement | — | 0C to +105C (TA) |
| Lead-Free | — | Yes (per distributor listing, Mouser 'NO-PB' coding) |
| Revision | — | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced |
| Packaging | — | Tray |
| ECCN | — | 5A002.a.1 |