MPC8360ZUAJDGA vs MPC8360EVVAGDGA Comparação
Comparação detalhada lado a lado de MPC8360ZUAJDGA por NXP Semiconductors e MPC8360EVVAGDGA por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MPC8360ZUAJDGA - PowerQUICC II Pro MPU, 533MHz e300, 740-TBGA | NXP
MPC8360ZUAJDGA ⚠ Última compraNXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Última compraComparação de especificações
| Parâmetro | MPC8360ZUAJDGA | MPC8360EVVAGDGA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Última compra | Última compra |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | PowerQUICC II Pro, MPC83xx | PowerQUICC II Pro (MPC8360E family) |
| Core Processor | PowerPC e300 | — |
| Core Architecture | Power Architecture, 32-bit | — |
| Number of Cores | 1 | 1 |
| Core Clock Speed | 533 MHz | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Process Technology | 0.13 micron CMOS | — |
| Encapsulamento | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA (37.5 x 37.5 mm) |
| Tipo de montagem | Surface Mount (T-BGA) | Surface Mount (TBGA ball grid) |
| Memory Controller | DDR1 / DDR2 with ECC | DDR1/DDR2 SDRAM with ECC |
| Ethernet | 10/100/1 GbE (GMII/RGMII) | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) | PCI 2.2 (32-bit, 66 MHz) / PCI-X |
| USB Interface | USB 2.0 (host/device) | — |
| Serial Interfaces | TDM, ATM, HDLC (QUICC Engine) | — |
| Supply Voltage Rails | 1.8 V / 2.5 V / 3.3 V | — |
| Temperatura de operação | 0 C to +105 C | — |
| Encryption | Non-encryption (no SEC) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] |
| Nível MSL | [DATA_NEEDED: MSL level] | — |
| Core | — | Power Architecture e300 (enhanced MPC603e) |
| Largura do barramento de dados | — | 32-bit |
| Frequência máxima de clock | — | 400 MHz |
| Operating Core Voltage | — | 1.2 V |
| I/O Voltage | — | 3.3 V |
| Security Engine | — | SEC (IPSEC/SSL/SRNG) |
| USB | — | USB 2.0 |
| TDM / H.110 | — | Yes |
| ATM Support | — | Yes (ATM SAR, AAL) |
| Faixa de temperatura de operação | — | 0C to +105C (TA) |
| Lead-Free | — | Yes (per distributor listing, Mouser 'NO-PB' coding) |
| Revision | — | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced |
| Packaging | — | Tray |
| ECCN | — | 5A002.a.1 |