MPC859TVR133A vs MPC866TZP133A Vergleich

Detaillierter Direktvergleich von MPC859TVR133A von NXP Semiconductors und MPC866TZP133A von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC859TVR133A MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA

MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA

MPC859TVR133A ✗ Abgekündigt
NXP Semiconductors
MPC866TZP133A MPC866TZP133A - MPC8xx PowerQUICC 133MHz BGA Processor | NXP

MPC866TZP133A - MPC8xx PowerQUICC 133MHz BGA Processor | NXP

MPC866TZP133A Obsolete

Spezifikationsvergleich

Parameter MPC859TVR133A MPC866TZP133A
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Ende des Lebenszyklus Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $54,10 $25,40
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Series PowerQUICC, MPC8xx family —
Core Architecture Power Architecture (32-bit) —
Core / Series Name MPC8xx —
Maximale Taktfrequenz 133 MHz —
Datenbusbreite 32 bit —
Number of Cores 1 1 Core, 32-Bit
Package Type 357-PBGA (Plastic Ball Grid Array) —
Package Dimensions 25 x 25 mm —
Betriebstemperatur 0C to +95C (commercial/industrial grade) 0 °C to +95 °C
On-Chip Cache 8 KB instruction / 8 KB data (per datasheet family) —
Communication Channels 4 SCC, 2 SMC, 1 FCC (typical MPC859T configuration) —
Peripheral Interfaces SPI, I2C, PCMCIA, IDMA, UART —
Montageart Surface Mount (BGA) —
RoHS-Status See manufacturer PCN (legacy status) Non-Compliant (contains lead - per datasheet)
Lifecycle End-of-Life per NXP product page —
Core Processor — MPC8xx Power Architecture (32-bit)
Core Speed — 133 MHz
External Bus Speed — 66 MHz
Co-Processors / DSP — Communications Processor Module (CPM)
Core Supply Voltage — 1.8 V
I/O Supply Voltage — 3.3 V (5 V TTL tolerant inputs)
Process Technology — 0.18 µm CMOS
Gehäuse — 357-PBGA (25x25 mm, 1.0 mm pitch)
Ethernet MACs — 4 x 10/100 Mbps + 2 x 10 Mbps
RAM Controllers — DRAM (up to 16 banks), SRAM, EPROM, Flash
Graphics Acceleration — No
Lead Free Status — Contains Lead
Part Status — Obsolete
Packaging — Tray

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern