MPC859TVR133A vs MPC866TZP133A Comparación

Comparación detallada lado a lado de MPC859TVR133A por NXP Semiconductors y MPC866TZP133A por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MPC859TVR133A MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA

MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA

MPC859TVR133A ✗ Fin de vida
NXP Semiconductors
MPC866TZP133A MPC866TZP133A - MPC8xx PowerQUICC 133MHz BGA Processor | NXP

MPC866TZP133A - MPC8xx PowerQUICC 133MHz BGA Processor | NXP

MPC866TZP133A Obsolete

Comparación de especificaciones

Parámetro MPC859TVR133A MPC866TZP133A
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida Fin de vida Obsolete
Estado del stock In Stock In Stock
Precio unitario (USD) $54,10 $25,40
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Series PowerQUICC, MPC8xx family —
Core Architecture Power Architecture (32-bit) —
Core / Series Name MPC8xx —
Frecuencia de reloj máxima 133 MHz —
Ancho del bus de datos 32 bit —
Number of Cores 1 1 Core, 32-Bit
Package Type 357-PBGA (Plastic Ball Grid Array) —
Package Dimensions 25 x 25 mm —
Temperatura de funcionamiento 0C to +95C (commercial/industrial grade) 0 °C to +95 °C
On-Chip Cache 8 KB instruction / 8 KB data (per datasheet family) —
Communication Channels 4 SCC, 2 SMC, 1 FCC (typical MPC859T configuration) —
Peripheral Interfaces SPI, I2C, PCMCIA, IDMA, UART —
Tipo de montaje Surface Mount (BGA) —
Estado RoHS See manufacturer PCN (legacy status) Non-Compliant (contains lead - per datasheet)
Lifecycle End-of-Life per NXP product page —
Core Processor — MPC8xx Power Architecture (32-bit)
Core Speed — 133 MHz
External Bus Speed — 66 MHz
Co-Processors / DSP — Communications Processor Module (CPM)
Core Supply Voltage — 1.8 V
I/O Supply Voltage — 3.3 V (5 V TTL tolerant inputs)
Process Technology — 0.18 µm CMOS
Encapsulado — 357-PBGA (25x25 mm, 1.0 mm pitch)
Ethernet MACs — 4 x 10/100 Mbps + 2 x 10 Mbps
RAM Controllers — DRAM (up to 16 banks), SRAM, EPROM, Flash
Graphics Acceleration — No
Lead Free Status — Contains Lead
Part Status — Obsolete
Packaging — Tray

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