MPC859TVR133A vs MPC866TZP133A Comparação

Comparação detalhada lado a lado de MPC859TVR133A por NXP Semiconductors e MPC866TZP133A por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC859TVR133A MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA

MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA

MPC859TVR133A ✗ Fim de vida
NXP Semiconductors
MPC866TZP133A MPC866TZP133A - MPC8xx PowerQUICC 133MHz BGA Processor | NXP

MPC866TZP133A - MPC8xx PowerQUICC 133MHz BGA Processor | NXP

MPC866TZP133A Obsolete

Comparação de especificações

Parâmetro MPC859TVR133A MPC866TZP133A
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Fim de vida Obsolete
Status do estoque In Stock In Stock
Preço unitário (USD) $54,10 $25,40
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Series PowerQUICC, MPC8xx family —
Core Architecture Power Architecture (32-bit) —
Core / Series Name MPC8xx —
Frequência máxima de clock 133 MHz —
Largura do barramento de dados 32 bit —
Number of Cores 1 1 Core, 32-Bit
Package Type 357-PBGA (Plastic Ball Grid Array) —
Package Dimensions 25 x 25 mm —
Temperatura de operação 0C to +95C (commercial/industrial grade) 0 °C to +95 °C
On-Chip Cache 8 KB instruction / 8 KB data (per datasheet family) —
Communication Channels 4 SCC, 2 SMC, 1 FCC (typical MPC859T configuration) —
Peripheral Interfaces SPI, I2C, PCMCIA, IDMA, UART —
Tipo de montagem Surface Mount (BGA) —
Status RoHS See manufacturer PCN (legacy status) Non-Compliant (contains lead - per datasheet)
Lifecycle End-of-Life per NXP product page —
Core Processor — MPC8xx Power Architecture (32-bit)
Core Speed — 133 MHz
External Bus Speed — 66 MHz
Co-Processors / DSP — Communications Processor Module (CPM)
Core Supply Voltage — 1.8 V
I/O Supply Voltage — 3.3 V (5 V TTL tolerant inputs)
Process Technology — 0.18 µm CMOS
Encapsulamento — 357-PBGA (25x25 mm, 1.0 mm pitch)
Ethernet MACs — 4 x 10/100 Mbps + 2 x 10 Mbps
RAM Controllers — DRAM (up to 16 banks), SRAM, EPROM, Flash
Graphics Acceleration — No
Lead Free Status — Contains Lead
Part Status — Obsolete
Packaging — Tray

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