MPC870CZT133 vs MPC875CZT133 Vergleich
Detaillierter Direktvergleich von MPC870CZT133 von NXP Semiconductors und MPC875CZT133 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC870CZT133 - MPC8xx 133MHz 32-Bit MPU | NXP | 256-PBGA
MPC870CZT133 ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MPC875CZT133 - PowerQUICC 32-Bit MPU, 133MHz, 256-BGA | NXP
MPC875CZT133 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC870CZT133 | MPC875CZT133 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $71,00 | $54,80 |
| Part Number | MPC870CZT133 | — |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Series | MPC8xx (PowerQUICC) | — |
| Core Architecture | PowerPC 32-bit RISC | Power Architecture (PowerPC) 32-bit |
| Number of Cores | 1 | — |
| Core Speed | 133 MHz | — |
| Datenbusbreite | 32-bit | — |
| Gehäuse | 256-PBGA (23x23 mm) | 256-Pin BGA (23x23 mm) |
| Package Code | HBGA, BGA-256 | — |
| Terminal Form | Ball | Ball |
| Number of Terminals | 256 | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| Versorgungsspannung | [DATA_NEEDED: supply voltage] | 3.3 V |
| On-chip Peripherals | Communications Processor Module (CPM), UART, HDLC, USB | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| RoHS-Status | unknown | RoHS non-compliant (contains lead) |
| Lead-Free | unknown | — |
| Halogenfrei | unknown | — |
| AEC-Q100 Qualified | not_applicable | — |
| Core Frequency | — | 133 MHz |
| Family | — | MPC8xx PowerQUICC |
| Processor Type | — | MPC8xx Communications Processor |
| Betriebstemperatur | — | -40 C to +100 C |
| Process Technology | — | 0.18 micron CMOS |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Ethernet MACs | — | Dual 10/100 (per datasheet) |
| System Core | — | Power Architecture technology |