MPC870CZT133 vs MPC875CZT133 Comparación
Comparación detallada lado a lado de MPC870CZT133 por NXP Semiconductors y MPC875CZT133 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC870CZT133 - MPC8xx 133MHz 32-Bit MPU | NXP | 256-PBGA
MPC870CZT133 ⚠ Última compraNXP Semiconductors
MPC875CZT133 - PowerQUICC 32-Bit MPU, 133MHz, 256-BGA | NXP
MPC875CZT133 ⚠ Última compraComparación de especificaciones
| Parámetro | MPC870CZT133 | MPC875CZT133 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $71,00 | $54,80 |
| Part Number | MPC870CZT133 | — |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Series | MPC8xx (PowerQUICC) | — |
| Core Architecture | PowerPC 32-bit RISC | Power Architecture (PowerPC) 32-bit |
| Number of Cores | 1 | — |
| Core Speed | 133 MHz | — |
| Ancho del bus de datos | 32-bit | — |
| Encapsulado | 256-PBGA (23x23 mm) | 256-Pin BGA (23x23 mm) |
| Package Code | HBGA, BGA-256 | — |
| Terminal Form | Ball | Ball |
| Number of Terminals | 256 | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Tensión de alimentación | [DATA_NEEDED: supply voltage] | 3.3 V |
| On-chip Peripherals | Communications Processor Module (CPM), UART, HDLC, USB | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | unknown | RoHS non-compliant (contains lead) |
| Lead-Free | unknown | — |
| Sin halógenos | unknown | — |
| AEC-Q100 Qualified | not_applicable | — |
| Core Frequency | — | 133 MHz |
| Family | — | MPC8xx PowerQUICC |
| Processor Type | — | MPC8xx Communications Processor |
| Temperatura de funcionamiento | — | -40 C to +100 C |
| Process Technology | — | 0.18 micron CMOS |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Ethernet MACs | — | Dual 10/100 (per datasheet) |
| System Core | — | Power Architecture technology |