MPC875CVR133 vs MPC870ZT133 Vergleich
Detaillierter Direktvergleich von MPC875CVR133 von NXP Semiconductors und MPC870ZT133 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC875CVR133 | MPC870ZT133 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $43,75 | $28,75 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP USA Inc. (formerly Freescale) |
| Product Category | Microprocessors (MPU) | — |
| Processor Series | MPC8xx / PowerQUICC | — |
| Core | MPC8xx (Power Architecture Technology) | — |
| Datenbusbreite | 32-bit | — |
| Maximale Taktfrequenz | 133 MHz | — |
| Performance | 176 MIPS | — |
| Number of Cores | 1 | 1 |
| Core Supply Voltage | 1.8 V | — |
| I/O Supply Voltage | 3.3 V | — |
| Betriebstemperatur | -40C to +100C | 0C to +95C (commercial) |
| Gehäuse | 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) | — |
| Montageart | Surface Mount | Surface Mount |
| On-chip Communication Processor Module (CPM) | Yes (FCC/SCC/SMC/USB/FEC/ATM) | — |
| RoHS-Status | [DATA_NEEDED: rohs status] | Non-Compliant (legacy part) |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Product Family | — | PowerQUICC MPC8xx |
| Processor Type | — | MPC8xx PowerQUICC, 32-Bit |
| Core Architecture | — | Power Architecture (G2_LE) |
| Core Frequency | — | 133 MHz |
| External Data Bus Width | — | 32-bit |
| Versorgungsspannung | — | 3.3 V I/O, 1.8 V core |
| Gehäuse / Bauform | — | 256-PBGA (23 x 23 mm) |
| Terminal Form | — | BALL |
| Number of Terminals | — | 256 |
| Package Code | — | HBGA |
| Lead Free Status | — | Contains Lead |
| Packaging | — | Tray |