MPC875VR133 vs MPC870VR66 Vergleich
Detaillierter Direktvergleich von MPC875VR133 von NXP Semiconductors und MPC870VR66 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC875VR133 | MPC870VR66 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $27,90 | $25,90 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors |
| Series | PowerQUICC, MPC8xx | PowerQUICC, MPC8xx |
| Core Architecture | Power Architecture (32-bit RISC) | — |
| Core Count | 1 | 1 |
| Core Frequency | 133 MHz | — |
| Performance | 176 MIPS | 87 MIPS |
| Datenbusbreite | 32 bit | 32-bit |
| Process Technology | 0.18 µm CMOS | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Betriebstemperatur | 0 °C to +95 °C | — |
| Package Type | 256-PBGA (HBGA), 23x23 mm | — |
| Terminal Pitch | 1.27 mm | — |
| On-chip Communications | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII | — |
| Memory Controller | SDRAM, Flash, SRAM, ROM support | — |
| PCI Bridge | Integrated (PCI 2.1) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Core Processor | — | MPC8xx Power Architecture |
| Speed | — | 66 MHz |
| Betriebsversorgungsspannung | — | 3.3 V |
| Betriebstemperaturbereich | — | 0C to +95C |
| Gehäuse / Bauform | — | 256-BGA (PBGA), 23x23 mm |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |
| Processor Type | — | MPC8xx PowerQUICC Communications Processor |