MPC875VR133 vs MPC870VR66 Comparación
Comparación detallada lado a lado de MPC875VR133 por NXP Semiconductors y MPC870VR66 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC875VR133 | MPC870VR66 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,90 | $25,90 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors |
| Series | PowerQUICC, MPC8xx | PowerQUICC, MPC8xx |
| Core Architecture | Power Architecture (32-bit RISC) | — |
| Core Count | 1 | 1 |
| Core Frequency | 133 MHz | — |
| Performance | 176 MIPS | 87 MIPS |
| Ancho del bus de datos | 32 bit | 32-bit |
| Process Technology | 0.18 µm CMOS | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Temperatura de funcionamiento | 0 °C to +95 °C | — |
| Package Type | 256-PBGA (HBGA), 23x23 mm | — |
| Terminal Pitch | 1.27 mm | — |
| On-chip Communications | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII | — |
| Memory Controller | SDRAM, Flash, SRAM, ROM support | — |
| PCI Bridge | Integrated (PCI 2.1) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Core Processor | — | MPC8xx Power Architecture |
| Speed | — | 66 MHz |
| Tensión de alimentación de funcionamiento | — | 3.3 V |
| Rango de temperatura de funcionamiento | — | 0C to +95C |
| Encapsulado / Carcasa | — | 256-BGA (PBGA), 23x23 mm |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |
| Processor Type | — | MPC8xx PowerQUICC Communications Processor |