MPC875VR133 vs MPC870VR66 对比
详细并排对比 MPC875VR133 出自 NXP Semiconductors 和 MPC870VR66 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC875VR133 | MPC870VR66 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Obsolete | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $27.90 | $25.90 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors |
| Series | PowerQUICC, MPC8xx | PowerQUICC, MPC8xx |
| Core Architecture | Power Architecture (32-bit RISC) | — |
| Core Count | 1 | 1 |
| Core Frequency | 133 MHz | — |
| Performance | 176 MIPS | 87 MIPS |
| 数据总线宽度 | 32 bit | 32-bit |
| Process Technology | 0.18 µm CMOS | — |
| Supply Voltage (I/O) | 3.3 V | — |
| 工作温度 | 0 °C to +95 °C | — |
| Package Type | 256-PBGA (HBGA), 23x23 mm | — |
| Terminal Pitch | 1.27 mm | — |
| On-chip Communications | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII | — |
| Memory Controller | SDRAM, Flash, SRAM, ROM support | — |
| PCI Bridge | Integrated (PCI 2.1) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| MSL 等级 | [DATA_NEEDED: MSL level] | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Core Processor | — | MPC8xx Power Architecture |
| Speed | — | 66 MHz |
| 工作电源电压 | — | 3.3 V |
| 工作温度范围 | — | 0C to +95C |
| 封装 / 外壳 | — | 256-BGA (PBGA), 23x23 mm |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |
| Processor Type | — | MPC8xx PowerQUICC Communications Processor |