MPC885VR133 vs MPC885ZP80 Vergleich
Detaillierter Direktvergleich von MPC885VR133 von NXP Semiconductors und MPC885ZP80 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC885VR133 - 133MHz PowerQUICC MPU 32-Bit | NXP | Networking
MPC885VR133 ✗ AbgekündigtNXP Semiconductors
MPC885ZP80 - PowerQUICC 32-Bit MPU, 80MHz, 357-BGA | NXP
MPC885ZP80 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC885VR133 | MPC885ZP80 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $27,40 | $25,85 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor, originally Motorola) | — |
| Series | MPC8xx / PowerQUICC | — |
| Core Architecture | MPC8xx (Power Architecture) | Power Architecture (MPC8xx) |
| Core Count | 1 Core | — |
| Datenbusbreite | 32-Bit | — |
| Maximale Taktfrequenz | 133 MHz | — |
| Performance | 176 MIPS | — |
| Instruction Cache | 8 KB | — |
| Data Cache | 8 KB | — |
| External Bus Frequency (Max) | 80 MHz | — |
| Gehäuse | 357-PBGA (25 mm x 25 mm) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Betriebstemperaturbereich | 0C to +95C | — |
| Versorgungsspannung | 3.3 V (core and I/O) | — |
| Ethernet Interfaces | 2x 10/100 Fast Ethernet MAC | — |
| USB Interface | USB 1.1 (Function or Host) | — |
| LCD Controller | Not present (V variant - reduced peripherals) | — |
| Security Engine | DES / 3DES / AES / MD-5 / SHA-1 | — |
| RoHS-Status | [DATA_NEEDED: confirm RoHS status] | Non-Compliant (legacy product) |
| Lebenszyklusstatus | End of Life (EOL); see NXP PCN for replacement options | — |
| Processor Type | — | MPC8xx PowerQUICC 32-Bit |
| Core Speed | — | 80 MHz |
| Operating Voltage | — | 3.3 V |
| Gehäuse / Bauform | — | 357-BBGA (PBGA, 25 x 25 mm) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Number of Cores | — | 1 |
| Bit Width | — | 32-Bit |
| Betriebstemperatur | — | 0 °C to +95 °C (commercial) |
| On-chip Communications Module | — | CPM (SCC/SMC/SPI/I2C) |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Process Technology | — | 0.18 µm CMOS |
| I/O Voltage | — | 3.3 V |