MPC885VR133 vs MPC885ZP80 Comparación
Comparación detallada lado a lado de MPC885VR133 por NXP Semiconductors y MPC885ZP80 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC885VR133 - 133MHz PowerQUICC MPU 32-Bit | NXP | Networking
MPC885VR133 ✗ Fin de vidaNXP Semiconductors
MPC885ZP80 - PowerQUICC 32-Bit MPU, 80MHz, 357-BGA | NXP
MPC885ZP80 ⚠ Última compraComparación de especificaciones
| Parámetro | MPC885VR133 | MPC885ZP80 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,40 | $25,85 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor, originally Motorola) | — |
| Series | MPC8xx / PowerQUICC | — |
| Core Architecture | MPC8xx (Power Architecture) | Power Architecture (MPC8xx) |
| Core Count | 1 Core | — |
| Ancho del bus de datos | 32-Bit | — |
| Frecuencia de reloj máxima | 133 MHz | — |
| Performance | 176 MIPS | — |
| Instruction Cache | 8 KB | — |
| Data Cache | 8 KB | — |
| External Bus Frequency (Max) | 80 MHz | — |
| Encapsulado | 357-PBGA (25 mm x 25 mm) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Rango de temperatura de funcionamiento | 0C to +95C | — |
| Tensión de alimentación | 3.3 V (core and I/O) | — |
| Ethernet Interfaces | 2x 10/100 Fast Ethernet MAC | — |
| USB Interface | USB 1.1 (Function or Host) | — |
| LCD Controller | Not present (V variant - reduced peripherals) | — |
| Security Engine | DES / 3DES / AES / MD-5 / SHA-1 | — |
| Estado RoHS | [DATA_NEEDED: confirm RoHS status] | Non-Compliant (legacy product) |
| Estado del ciclo de vida | End of Life (EOL); see NXP PCN for replacement options | — |
| Processor Type | — | MPC8xx PowerQUICC 32-Bit |
| Core Speed | — | 80 MHz |
| Operating Voltage | — | 3.3 V |
| Encapsulado / Carcasa | — | 357-BBGA (PBGA, 25 x 25 mm) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Number of Cores | — | 1 |
| Bit Width | — | 32-Bit |
| Temperatura de funcionamiento | — | 0 °C to +95 °C (commercial) |
| On-chip Communications Module | — | CPM (SCC/SMC/SPI/I2C) |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Process Technology | — | 0.18 µm CMOS |
| I/O Voltage | — | 3.3 V |