MPC885VR133 vs MPC885ZP80 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC885VR133 sa pamamagitan ng NXP Semiconductors at MPC885ZP80 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC885VR133 - 133MHz PowerQUICC MPU 32-Bit | NXP | Networking
MPC885VR133 ✗ Tapus ng BuhayNXP Semiconductors
MPC885ZP80 - PowerQUICC 32-Bit MPU, 80MHz, 357-BGA | NXP
MPC885ZP80 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | MPC885VR133 | MPC885ZP80 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | Huling Pagbili |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor, originally Motorola) | — |
| Series | MPC8xx / PowerQUICC | — |
| Core Architecture | MPC8xx (Power Architecture) | Power Architecture (MPC8xx) |
| Core Count | 1 Core | — |
| Width ng Data Bus | 32-Bit | — |
| Maksimum na Taktiko ng Oras | 133 MHz | — |
| Performance | 176 MIPS | — |
| Instruction Cache | 8 KB | — |
| Data Cache | 8 KB | — |
| External Bus Frequency (Max) | 80 MHz | — |
| Packhaging | 357-PBGA (25 mm x 25 mm) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Hanay ng Temperature na Operasyon | 0C to +95C | — |
| Volte ng Pagbibigay | 3.3 V (core and I/O) | — |
| Ethernet Interfaces | 2x 10/100 Fast Ethernet MAC | — |
| USB Interface | USB 1.1 (Function or Host) | — |
| LCD Controller | Not present (V variant - reduced peripherals) | — |
| Security Engine | DES / 3DES / AES / MD-5 / SHA-1 | — |
| Tindminan RoHS | [DATA_NEEDED: confirm RoHS status] | Non-Compliant (legacy product) |
| Katayuan ng Lifecycle | End of Life (EOL); see NXP PCN for replacement options | — |
| Processor Type | — | MPC8xx PowerQUICC 32-Bit |
| Core Speed | — | 80 MHz |
| Operating Voltage | — | 3.3 V |
| Packhaging / Kaso | — | 357-BBGA (PBGA, 25 x 25 mm) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Number of Cores | — | 1 |
| Bit Width | — | 32-Bit |
| Temperature na Operasyon | — | 0 °C to +95 °C (commercial) |
| On-chip Communications Module | — | CPM (SCC/SMC/SPI/I2C) |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |
| Process Technology | — | 0.18 µm CMOS |
| I/O Voltage | — | 3.3 V |