MRFE6P9220HR3 vs MRFE6S9200HR3 Vergleich
Detaillierter Direktvergleich von MRFE6P9220HR3 von NXP Semiconductors und MRFE6S9200HR3 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MRFE6P9220HR3 | MRFE6S9200HR3 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | MOSFETs | MOSFETs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $232,20 | $52,30 |
| Transistortyp | LDMOS, N-Channel Enhancement-Mode, Lateral | N-Channel LDMOS (RF Power) |
| Technology | RF Power MOSFET | Enhancement-mode LDMOS (HV6E) |
| Frequency Range | 865 MHz to 1000 MHz | — |
| Test Frequency | 880 MHz | — |
| Drain-Source Voltage (Vdss) Max | 66 V | — |
| Test Supply Voltage | 28 V | 28 V |
| Test Drain Current | 1.6 A | — |
| Output Power (Avg, N-CDMA) | 47 W | — |
| Peak Output Power | 200 W | — |
| Power Gain (Typ) | 20 dB at 880 MHz | — |
| Drain Efficiency | [DATA_NEEDED: typical drain efficiency % at 47 W avg] | — |
| Gehäuse | NI-860C3 (NI860ML), ceramic-metal sealed cofired, surface mount | NI-880H-2L ceramic air-cavity |
| Configuration | Common source, 2 elements | — |
| Montageart | Surface Mount with copper heatsink pad | Chassis / flange mount, SMD variant 5.08 mm height |
| Betriebstemperaturbereich | [DATA_NEEDED: Tj max / operating range] | — |
| Lead Free Status | Lead Free | Lead Free (per datasheet) |
| RoHS-Status | Compliant | Compliant |
| Frequency | — | 880 MHz (test), broadband up to 1000 MHz |
| Drain-Source Voltage (Vdss) Rated | — | 66 V |
| Test Quiescent Current | — | 1.4 A |
| Output Power (Avg) | — | 58 W (W-CDMA) |
| Power Gain | — | 21 dB at 880 MHz |
| Input Capacitance (Ciss) | — | 557.27 pF at 28 V |
| Operating Mode | — | Class AB, Class C, Doherty |
| Target Application | — | W-CDMA base-station final stage |