MSC8154ETVT1000B vs MSC8251SVT1000B Vergleich
Detaillierter Direktvergleich von MSC8154ETVT1000B von NXP Semiconductors und MSC8251SVT1000B von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MSC8154ETVT1000B - Quad-Core SC3850 DSP 1GHz FCBGA-783 | NXP
MSC8154ETVT1000B ObsoleteSpezifikationsvergleich
| Parameter | MSC8154ETVT1000B | MSC8251SVT1000B |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $171,00 | $65,00 |
| Core Architecture | StarCore SC3850 (quad-core) | SC3850 StarCore, single core |
| Number of Cores | 4 | — |
| Core Clock Frequency | 1 GHz | — |
| Performance | 1000 MIPS per core (4000 MIPS aggregate) | — |
| L1 Instruction Cache | 32 KB per core | 32 KB |
| L1 Data Cache | 32 KB per core | 32 KB |
| L2 Unified Cache | 512 KB | 512 KB (configurable, SRAM or MAP) |
| On-Chip RAM | 576 KB | 576 KB |
| On-Chip ROM | 96 KB | — |
| External Memory Interface | DDR2/DDR3 controller | — |
| High-Speed Serial Interfaces | Serial RapidIO, PCI Express | — |
| Ethernet Interfaces | 2x RGMII Gigabit Ethernet MACs | — |
| Peripheral Interfaces | I2C, SPI, UART, TDM | — |
| Security Engine | Integrated (IPSec, Kasumi, Snow 3G) | — |
| Gehäuse | 783-FCPBGA (29x29 mm) | — |
| Operating Temperature Grade | Industrial | — |
| RoHS-Status | Compliant | Compliant |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Core Revision | — | StarCore R2.1 |
| Maximum Core Clock | — | 1 GHz |
| MIPS | — | [DATA_NEEDED: MIPS rating for 1 GHz SC3850] |
| Internal ROM | — | 96 KB |
| TDM Interfaces | — | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support |
| Ethernet MAC | — | Yes (integrated) |
| PCI Express | — | Yes (integrated controller) |
| Serial RapidIO | — | Yes (SERDES-based) |
| DMA Controller | — | Multi-channel DMA |
| Package Type | — | FCBGA (Flip-Chip Ball Grid Array) |
| Package Pin Count | — | 783 balls |
| Package Dimensions | — | 29 mm x 29 mm |
| Montageart | — | Surface Mount |
| Lead-Free / Halogen-Free | — | Yes (lead-free, halogen-free package) |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature grade] |