MSC8154ETVT1000B vs MSC8251SVT1000B Сравнение
Подробное сравнение бок о бок MSC8154ETVT1000B от NXP Semiconductors и MSC8251SVT1000B от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
MSC8154ETVT1000B - Quad-Core SC3850 DSP 1GHz FCBGA-783 | NXP
MSC8154ETVT1000B ObsoleteСравнение характеристик
| Параметр | MSC8154ETVT1000B | MSC8251SVT1000B |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | DSP | DSP |
| Статус жизненного цикла | Obsolete | Obsolete |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $171,00 | $65,00 |
| Core Architecture | StarCore SC3850 (quad-core) | SC3850 StarCore, single core |
| Number of Cores | 4 | — |
| Core Clock Frequency | 1 GHz | — |
| Performance | 1000 MIPS per core (4000 MIPS aggregate) | — |
| L1 Instruction Cache | 32 KB per core | 32 KB |
| L1 Data Cache | 32 KB per core | 32 KB |
| L2 Unified Cache | 512 KB | 512 KB (configurable, SRAM or MAP) |
| On-Chip RAM | 576 KB | 576 KB |
| On-Chip ROM | 96 KB | — |
| External Memory Interface | DDR2/DDR3 controller | — |
| High-Speed Serial Interfaces | Serial RapidIO, PCI Express | — |
| Ethernet Interfaces | 2x RGMII Gigabit Ethernet MACs | — |
| Peripheral Interfaces | I2C, SPI, UART, TDM | — |
| Security Engine | Integrated (IPSec, Kasumi, Snow 3G) | — |
| Корпус | 783-FCPBGA (29x29 mm) | — |
| Operating Temperature Grade | Industrial | — |
| Статус RoHS | Compliant | Compliant |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Core Revision | — | StarCore R2.1 |
| Maximum Core Clock | — | 1 GHz |
| MIPS | — | [DATA_NEEDED: MIPS rating for 1 GHz SC3850] |
| Internal ROM | — | 96 KB |
| TDM Interfaces | — | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support |
| Ethernet MAC | — | Yes (integrated) |
| PCI Express | — | Yes (integrated controller) |
| Serial RapidIO | — | Yes (SERDES-based) |
| DMA Controller | — | Multi-channel DMA |
| Package Type | — | FCBGA (Flip-Chip Ball Grid Array) |
| Package Pin Count | — | 783 balls |
| Package Dimensions | — | 29 mm x 29 mm |
| Тип монтажа | — | Surface Mount |
| Lead-Free / Halogen-Free | — | Yes (lead-free, halogen-free package) |
| Рабочая температура | — | [DATA_NEEDED: operating temperature grade] |