MSC8154ETVT1000B vs MSC8251SVT1000B Comparaison
Comparaison détaillée côte à côte de MSC8154ETVT1000B par NXP Semiconductors et MSC8251SVT1000B par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MSC8154ETVT1000B - Quad-Core SC3850 DSP 1GHz FCBGA-783 | NXP
MSC8154ETVT1000B ObsoleteComparaison des spécifications
| Paramètre | MSC8154ETVT1000B | MSC8251SVT1000B |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | DSP | DSP |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $171,00 | $65,00 |
| Core Architecture | StarCore SC3850 (quad-core) | SC3850 StarCore, single core |
| Number of Cores | 4 | — |
| Core Clock Frequency | 1 GHz | — |
| Performance | 1000 MIPS per core (4000 MIPS aggregate) | — |
| L1 Instruction Cache | 32 KB per core | 32 KB |
| L1 Data Cache | 32 KB per core | 32 KB |
| L2 Unified Cache | 512 KB | 512 KB (configurable, SRAM or MAP) |
| On-Chip RAM | 576 KB | 576 KB |
| On-Chip ROM | 96 KB | — |
| External Memory Interface | DDR2/DDR3 controller | — |
| High-Speed Serial Interfaces | Serial RapidIO, PCI Express | — |
| Ethernet Interfaces | 2x RGMII Gigabit Ethernet MACs | — |
| Peripheral Interfaces | I2C, SPI, UART, TDM | — |
| Security Engine | Integrated (IPSec, Kasumi, Snow 3G) | — |
| Boîtier | 783-FCPBGA (29x29 mm) | — |
| Operating Temperature Grade | Industrial | — |
| Statut RoHS | Compliant | Compliant |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Core Revision | — | StarCore R2.1 |
| Maximum Core Clock | — | 1 GHz |
| MIPS | — | [DATA_NEEDED: MIPS rating for 1 GHz SC3850] |
| Internal ROM | — | 96 KB |
| TDM Interfaces | — | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support |
| Ethernet MAC | — | Yes (integrated) |
| PCI Express | — | Yes (integrated controller) |
| Serial RapidIO | — | Yes (SERDES-based) |
| DMA Controller | — | Multi-channel DMA |
| Package Type | — | FCBGA (Flip-Chip Ball Grid Array) |
| Package Pin Count | — | 783 balls |
| Package Dimensions | — | 29 mm x 29 mm |
| Type de montage | — | Surface Mount |
| Lead-Free / Halogen-Free | — | Yes (lead-free, halogen-free package) |
| Température de fonctionnement | — | [DATA_NEEDED: operating temperature grade] |