MSC8154ETVT1000B vs MSC8251SVT1000B Comparação
Comparação detalhada lado a lado de MSC8154ETVT1000B por NXP Semiconductors e MSC8251SVT1000B por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MSC8154ETVT1000B - Quad-Core SC3850 DSP 1GHz FCBGA-783 | NXP
MSC8154ETVT1000B ObsoleteComparação de especificações
| Parâmetro | MSC8154ETVT1000B | MSC8251SVT1000B |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | DSP | DSP |
| Status do ciclo de vida | Obsolete | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $171,00 | $65,00 |
| Core Architecture | StarCore SC3850 (quad-core) | SC3850 StarCore, single core |
| Number of Cores | 4 | — |
| Core Clock Frequency | 1 GHz | — |
| Performance | 1000 MIPS per core (4000 MIPS aggregate) | — |
| L1 Instruction Cache | 32 KB per core | 32 KB |
| L1 Data Cache | 32 KB per core | 32 KB |
| L2 Unified Cache | 512 KB | 512 KB (configurable, SRAM or MAP) |
| On-Chip RAM | 576 KB | 576 KB |
| On-Chip ROM | 96 KB | — |
| External Memory Interface | DDR2/DDR3 controller | — |
| High-Speed Serial Interfaces | Serial RapidIO, PCI Express | — |
| Ethernet Interfaces | 2x RGMII Gigabit Ethernet MACs | — |
| Peripheral Interfaces | I2C, SPI, UART, TDM | — |
| Security Engine | Integrated (IPSec, Kasumi, Snow 3G) | — |
| Encapsulamento | 783-FCPBGA (29x29 mm) | — |
| Operating Temperature Grade | Industrial | — |
| Status RoHS | Compliant | Compliant |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Core Revision | — | StarCore R2.1 |
| Maximum Core Clock | — | 1 GHz |
| MIPS | — | [DATA_NEEDED: MIPS rating for 1 GHz SC3850] |
| Internal ROM | — | 96 KB |
| TDM Interfaces | — | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support |
| Ethernet MAC | — | Yes (integrated) |
| PCI Express | — | Yes (integrated controller) |
| Serial RapidIO | — | Yes (SERDES-based) |
| DMA Controller | — | Multi-channel DMA |
| Package Type | — | FCBGA (Flip-Chip Ball Grid Array) |
| Package Pin Count | — | 783 balls |
| Package Dimensions | — | 29 mm x 29 mm |
| Tipo de montagem | — | Surface Mount |
| Lead-Free / Halogen-Free | — | Yes (lead-free, halogen-free package) |
| Temperatura de operação | — | [DATA_NEEDED: operating temperature grade] |