S5LS10106ASPGEQQ1 vs TMS5701227CPGEQQ1 Vergleich
Detaillierter Direktvergleich von S5LS10106ASPGEQQ1 von Texas Instruments und TMS5701227CPGEQQ1 von Texas Instruments. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Texas Instruments
S5LS10106ASPGEQQ1 - Hercules TMS570 Cortex-R4F MCU 1MB Flash 144LQFP | TI
S5LS10106ASPGEQQ1 ✓ AktivTexas Instruments
TMS5701227CPGEQQ1 - 160MHz Cortex-R4F Dual-Core MCU | Texas Instruments
TMS5701227CPGEQQ1 ✓ AktivSpezifikationsvergleich
| Parameter | S5LS10106ASPGEQQ1 | TMS5701227CPGEQQ1 |
|---|---|---|
| Marke | Texas Instruments | Texas Instruments |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,85 | $21,50 |
| Core Architecture | ARM Cortex-R4F (Hercules TMS570 family) | 32-bit RISC with IEEE-754 single-precision FPU |
| Datenbusbreite | 16/32-bit | — |
| Maximale Taktfrequenz | 140 MHz | — |
| Program Memory Size | 1 MB (1M x 8) Flash | — |
| Program Memory Type | Flash (with ECC) | — |
| RAM Size | 128 KB (1M x 8) | — |
| Number of I/O | 68 | — |
| ADC Resolution | 12-bit | — |
| Betriebsversorgungsspannung | 1.5 V (core) / 3.3 V (I/O) | — |
| Betriebstemperaturbereich | -40C to +125C | -40C to +125C (automotive grade) |
| Gehäuse / Bauform | 144-LQFP (20x20 mm) | — |
| Montagestil | SMD/SMT (gull wing) | — |
| Supply Type | External clock (programmable ECLK output) | — |
| Communication Interfaces | MibSPI x3 (4 chip selects each), SCI/UART x2, CAN x2 | — |
| AEC-Q100 Qualification | Yes (automotive grade) | — |
| RoHS-Status | Compliant (TI datasheet) | Compliant |
| Manufacturer | — | Texas Instruments |
| Series | — | Hercules TMS570 ARM Cortex-R4F |
| Core Processor | — | ARM Cortex-R4F (dual-core, lockstep) |
| Maximum Clock Speed | — | 160 MHz |
| Program Memory (Flash) | — | 1.25 MB (1.25M x 8) with ECC |
| Data RAM | — | 192 KB with ECC (SECDED) |
| Bus Width | — | 32-bit (64-bit flash bus per TI documentation) |
| Operating Voltage Range | — | 1.2 V core / 3.3 V I/O (typical dual-rail) |
| Gehäuse | — | 144-LQFP (PGE) 20x20 mm |
| Montageart | — | Surface Mount |
| Automotive Qualification | — | AEC-Q100 Grade (-40C to +125C) |
| Connectivity | — | FlexRay, EMAC, CAN, SPI, LIN, UART, I2C |
| ADC | — | 12-bit MibADC (Multi-buffered ADC) |
| PWM Channels | — | Enhanced ePWM with trip-zone protection (per TI datasheet) |
| MSL-Level | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Functional Safety | — | Dual lockstep cores + ECC + parity + peripheral loopback (ASIL-D capable per datasheet) |
| Supplier Device Package | — | 144-LQFP (PGE) |