S5LS10106ASPGEQQ1 vs TMS5701227CPGEQQ1 Comparación
Comparación detallada lado a lado de S5LS10106ASPGEQQ1 por Texas Instruments y TMS5701227CPGEQQ1 por Texas Instruments. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Texas Instruments
S5LS10106ASPGEQQ1 - Hercules TMS570 Cortex-R4F MCU 1MB Flash 144LQFP | TI
S5LS10106ASPGEQQ1 ✓ ActivoTexas Instruments
TMS5701227CPGEQQ1 - 160MHz Cortex-R4F Dual-Core MCU | Texas Instruments
TMS5701227CPGEQQ1 ✓ ActivoComparación de especificaciones
| Parámetro | S5LS10106ASPGEQQ1 | TMS5701227CPGEQQ1 |
|---|---|---|
| Marca | Texas Instruments | Texas Instruments |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10,85 | $21,50 |
| Core Architecture | ARM Cortex-R4F (Hercules TMS570 family) | 32-bit RISC with IEEE-754 single-precision FPU |
| Ancho del bus de datos | 16/32-bit | — |
| Frecuencia de reloj máxima | 140 MHz | — |
| Program Memory Size | 1 MB (1M x 8) Flash | — |
| Program Memory Type | Flash (with ECC) | — |
| RAM Size | 128 KB (1M x 8) | — |
| Number of I/O | 68 | — |
| ADC Resolution | 12-bit | — |
| Tensión de alimentación de funcionamiento | 1.5 V (core) / 3.3 V (I/O) | — |
| Rango de temperatura de funcionamiento | -40C to +125C | -40C to +125C (automotive grade) |
| Encapsulado / Carcasa | 144-LQFP (20x20 mm) | — |
| Estilo de montaje | SMD/SMT (gull wing) | — |
| Supply Type | External clock (programmable ECLK output) | — |
| Communication Interfaces | MibSPI x3 (4 chip selects each), SCI/UART x2, CAN x2 | — |
| AEC-Q100 Qualification | Yes (automotive grade) | — |
| Estado RoHS | Compliant (TI datasheet) | Compliant |
| Manufacturer | — | Texas Instruments |
| Series | — | Hercules TMS570 ARM Cortex-R4F |
| Core Processor | — | ARM Cortex-R4F (dual-core, lockstep) |
| Maximum Clock Speed | — | 160 MHz |
| Program Memory (Flash) | — | 1.25 MB (1.25M x 8) with ECC |
| Data RAM | — | 192 KB with ECC (SECDED) |
| Bus Width | — | 32-bit (64-bit flash bus per TI documentation) |
| Operating Voltage Range | — | 1.2 V core / 3.3 V I/O (typical dual-rail) |
| Encapsulado | — | 144-LQFP (PGE) 20x20 mm |
| Tipo de montaje | — | Surface Mount |
| Automotive Qualification | — | AEC-Q100 Grade (-40C to +125C) |
| Connectivity | — | FlexRay, EMAC, CAN, SPI, LIN, UART, I2C |
| ADC | — | 12-bit MibADC (Multi-buffered ADC) |
| PWM Channels | — | Enhanced ePWM with trip-zone protection (per TI datasheet) |
| Nivel MSL | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Functional Safety | — | Dual lockstep cores + ECC + parity + peripheral loopback (ASIL-D capable per datasheet) |
| Supplier Device Package | — | 144-LQFP (PGE) |