S5LS10106ASPGEQQ1 vs TMS5701227CPGEQQ1 비교
다음의 상세 나란히 비교: S5LS10106ASPGEQQ1 제조: Texas Instruments 및 TMS5701227CPGEQQ1 제조: Texas Instruments. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Texas Instruments
S5LS10106ASPGEQQ1 - Hercules TMS570 Cortex-R4F MCU 1MB Flash 144LQFP | TI
S5LS10106ASPGEQQ1 ✓ 활성Texas Instruments
TMS5701227CPGEQQ1 - 160MHz Cortex-R4F Dual-Core MCU | Texas Instruments
TMS5701227CPGEQQ1 ✓ 활성사양 비교
| 파라미터 | S5LS10106ASPGEQQ1 | TMS5701227CPGEQQ1 |
|---|---|---|
| 브랜드 | Texas Instruments | Texas Instruments |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $10.85 | $21.50 |
| Core Architecture | ARM Cortex-R4F (Hercules TMS570 family) | 32-bit RISC with IEEE-754 single-precision FPU |
| 데이터 버스 폭 | 16/32-bit | — |
| 최대 클록 주파수 | 140 MHz | — |
| Program Memory Size | 1 MB (1M x 8) Flash | — |
| Program Memory Type | Flash (with ECC) | — |
| RAM Size | 128 KB (1M x 8) | — |
| Number of I/O | 68 | — |
| ADC Resolution | 12-bit | — |
| 동작 공급 전압 | 1.5 V (core) / 3.3 V (I/O) | — |
| 동작 온도 범위 | -40C to +125C | -40C to +125C (automotive grade) |
| 패키지 / 케이스 | 144-LQFP (20x20 mm) | — |
| 장착 스타일 | SMD/SMT (gull wing) | — |
| Supply Type | External clock (programmable ECLK output) | — |
| Communication Interfaces | MibSPI x3 (4 chip selects each), SCI/UART x2, CAN x2 | — |
| AEC-Q100 Qualification | Yes (automotive grade) | — |
| RoHS 상태 | Compliant (TI datasheet) | Compliant |
| Manufacturer | — | Texas Instruments |
| Series | — | Hercules TMS570 ARM Cortex-R4F |
| Core Processor | — | ARM Cortex-R4F (dual-core, lockstep) |
| Maximum Clock Speed | — | 160 MHz |
| Program Memory (Flash) | — | 1.25 MB (1.25M x 8) with ECC |
| Data RAM | — | 192 KB with ECC (SECDED) |
| Bus Width | — | 32-bit (64-bit flash bus per TI documentation) |
| Operating Voltage Range | — | 1.2 V core / 3.3 V I/O (typical dual-rail) |
| 패키지 | — | 144-LQFP (PGE) 20x20 mm |
| 실장 유형 | — | Surface Mount |
| Automotive Qualification | — | AEC-Q100 Grade (-40C to +125C) |
| Connectivity | — | FlexRay, EMAC, CAN, SPI, LIN, UART, I2C |
| ADC | — | 12-bit MibADC (Multi-buffered ADC) |
| PWM Channels | — | Enhanced ePWM with trip-zone protection (per TI datasheet) |
| MSL 레벨 | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Functional Safety | — | Dual lockstep cores + ECC + parity + peripheral loopback (ASIL-D capable per datasheet) |
| Supplier Device Package | — | 144-LQFP (PGE) |