S9S08AW60E5MFGE vs MC9S08AW60CFUE Vergleich
Detaillierter Direktvergleich von S9S08AW60E5MFGE von NXP Semiconductors und MC9S08AW60CFUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ Aktiv
Spezifikationsvergleich
| Parameter | S9S08AW60E5MFGE | MC9S08AW60CFUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6,05 | $8,10 |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 4 KB |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Versorgungsspannung | 3 V / 3.3 V / 5 V | 2.7 V to 5.5 V |
| Gehäuse | 44-pin LQFP (10 x 10 mm) | 64-QFP, 14 x 14 mm |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | — |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | — |
| Debug Interface | BDM (Background Debug Mode) | Single-wire background debug mode interface |
| Betriebstemperatur | -40C to +125C (automotive range) | — |
| Montageart | Surface Mount | — |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Product Type | — | 8-bit HCS08 microcontroller |
| CPU Frequency | — | 40 MHz |
| Program Memory | — | 60 KB Flash |
| Core | — | Enhanced HCS08 8-bit core |
| Internal Bus Frequency | — | 20 MHz |
| I/O Ports | — | 38 ports |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Package Height | — | 1 mm |
| Package Pitch | — | 0.50 mm |
| Montagestil | — | Surface mount |
| Instruction Cycle | — | 50 ns minimum at 2.7 V and 20 MHz bus |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Application Support | — | Industrial and automotive |
| Lebenszyklusstatus | — | NRND |
| Supplier Reference | — | NXP USA Inc. |