S9S08AW60E5MFGE vs MC9S08AW60CFUE 对比

详细并排对比 S9S08AW60E5MFGE 出自 NXP Semiconductors 和 MC9S08AW60CFUE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
S9S08AW60E5MFGE S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE ✓ 量产中
NXP Semiconductors
MC9S08AW60CFUE MC9S08AW60CFUE - 40MHz 60KB Flash 8-Bit MCU | NXP

MC9S08AW60CFUE - 40MHz 60KB Flash 8-Bit MCU | NXP

MC9S08AW60CFUE Nrnd

规格对比

参数 S9S08AW60E5MFGE MC9S08AW60CFUE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 不推荐新设计
库存状态 有库存 有库存
单价(USD) $6.05 $8.10
Core Architecture HCS08 (S08 enhanced), 8-bit CISC —
CPU Clock (Max) 40 MHz (20 MHz bus) —
Program Flash 60 KB (60K x 8) —
RAM [DATA_NEEDED: RAM size] 4 KB
EEPROM / Data Flash [DATA_NEEDED: data EEPROM size] —
电源电压 3 V / 3.3 V / 5 V 2.7 V to 5.5 V
封装 44-pin LQFP (10 x 10 mm) 64-QFP, 14 x 14 mm
I/O Pins [DATA_NEEDED: GPIO count] —
ADC Multi-channel 10-bit (per family) —
Communication SCI (UART), SPI, I2C —
Timers TPM modules with PWM channels —
Debug Interface BDM (Background Debug Mode) Single-wire background debug mode interface
工作温度 -40C to +125C (automotive range) —
安装类型 Surface Mount —
Family S08 / MC9S08AW60 series —
Automotive/Industrial Dual-targeted —
Lead Free / RoHS Yes (per suffix "E" = Pb-free, "R" = tape & reel) —
Product Type — 8-bit HCS08 microcontroller
CPU Frequency — 40 MHz
Program Memory — 60 KB Flash
Core — Enhanced HCS08 8-bit core
Internal Bus Frequency — 20 MHz
I/O Ports — 38 ports
Connectivity — I2C, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Package Height — 1 mm
Package Pitch — 0.50 mm
安装方式 — Surface mount
Instruction Cycle — 50 ns minimum at 2.7 V and 20 MHz bus
Instruction Set — HC08 instruction set with added BGND instruction
Application Support — Industrial and automotive
生命周期状态 — NRND
Supplier Reference — NXP USA Inc.

数据手册与资源

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