S9S08AW60E5MFGE vs MC9S08AW60CFUE Comparación
Comparación detallada lado a lado de S9S08AW60E5MFGE por NXP Semiconductors y MC9S08AW60CFUE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ Activo
Comparación de especificaciones
| Parámetro | S9S08AW60E5MFGE | MC9S08AW60CFUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6,05 | $8,10 |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 4 KB |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Tensión de alimentación | 3 V / 3.3 V / 5 V | 2.7 V to 5.5 V |
| Encapsulado | 44-pin LQFP (10 x 10 mm) | 64-QFP, 14 x 14 mm |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | — |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | — |
| Debug Interface | BDM (Background Debug Mode) | Single-wire background debug mode interface |
| Temperatura de funcionamiento | -40C to +125C (automotive range) | — |
| Tipo de montaje | Surface Mount | — |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Product Type | — | 8-bit HCS08 microcontroller |
| CPU Frequency | — | 40 MHz |
| Program Memory | — | 60 KB Flash |
| Core | — | Enhanced HCS08 8-bit core |
| Internal Bus Frequency | — | 20 MHz |
| I/O Ports | — | 38 ports |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Package Height | — | 1 mm |
| Package Pitch | — | 0.50 mm |
| Estilo de montaje | — | Surface mount |
| Instruction Cycle | — | 50 ns minimum at 2.7 V and 20 MHz bus |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Application Support | — | Industrial and automotive |
| Estado del ciclo de vida | — | NRND |
| Supplier Reference | — | NXP USA Inc. |