S9S08AW60E5MFGE vs MC9S08AW60CFUE Comparaison
Comparaison détaillée côte à côte de S9S08AW60E5MFGE par NXP Semiconductors et MC9S08AW60CFUE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ Actif
Comparaison des spécifications
| Paramètre | S9S08AW60E5MFGE | MC9S08AW60CFUE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $6,05 | $8,10 |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 4 KB |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Tension d'alimentation | 3 V / 3.3 V / 5 V | 2.7 V to 5.5 V |
| Boîtier | 44-pin LQFP (10 x 10 mm) | 64-QFP, 14 x 14 mm |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | — |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | — |
| Debug Interface | BDM (Background Debug Mode) | Single-wire background debug mode interface |
| Température de fonctionnement | -40C to +125C (automotive range) | — |
| Type de montage | Surface Mount | — |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Product Type | — | 8-bit HCS08 microcontroller |
| CPU Frequency | — | 40 MHz |
| Program Memory | — | 60 KB Flash |
| Core | — | Enhanced HCS08 8-bit core |
| Internal Bus Frequency | — | 20 MHz |
| I/O Ports | — | 38 ports |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Package Height | — | 1 mm |
| Package Pitch | — | 0.50 mm |
| Style de montage | — | Surface mount |
| Instruction Cycle | — | 50 ns minimum at 2.7 V and 20 MHz bus |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Application Support | — | Industrial and automotive |
| Statut du cycle de vie | — | NRND |
| Supplier Reference | — | NXP USA Inc. |