TD1205 vs TD1207 Vergleich

Detaillierter Direktvergleich von TD1205 von TD next und TD1207 von TD next. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter TD1205 TD1207
Marke TD next TD next
Kategorie RF Modules RF Modules
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $10,50 $8,95
Product Type Sigfox-certified RF transceiver module Sigfox RF Transceiver Module
Manufacturer TD next (Telecom Design) Telecom Design / TD next
RF Protocol Sigfox (Ultra-Narrow-Band LPWAN) —
Operating Frequency (RC1) 868 MHz (ETSI Europe) —
Operating Frequency (RC2) 902-928 MHz (US, Australia, Japan) —
Tx Power (RC1) +14 dBm typical —
Tx Power (RC2) +22 dBm maximum —
Receiver Sensitivity [DATA_NEEDED: receiver sensitivity] —
Integrated Microcontroller ARM Cortex-M0+ (STM32 family) —
Clock Reference Integrated TCXO —
Host Interface UART, SPI, I2C, GPIO UART (AT commands), SPI, GPIO
Modulation Ultra-Narrow-Band (UNB), DBPSK uplink Sigfox ultra-narrowband (UNB)
Maximum Payload Size 12 bytes per uplink message —
Versorgungsspannung [DATA_NEEDED: VBAT operating range] 3.3 V typical (single rail)
Betriebstemperatur -40C to +85C -30 C to +70 C
Form Factor Surface-mount LGA castellation module Surface-mount module
Montageart Surface Mount (reflow) SMT (castellated edge pads)
RoHS-Status Compliant Compliant
Operating Frequency Bands — 868 MHz (ETSI) / 902 MHz (FCC)
Protocol — Sigfox (RC1 / RC2 / RC3 / RC4 zone-ready)
RX Sensitivity (typical) — -126 dBm
TX Output Power (max) — +14 dBm
Baseband Processor — ARM Cortex-M3
Antenna Interface — SMA / U.FL footprint (model dependent)

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