TD1205 vs TD1207 비교
다음의 상세 나란히 비교: TD1205 제조: TD next 및 TD1207 제조: TD next. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | TD1205 | TD1207 |
|---|---|---|
| 브랜드 | TD next | TD next |
| 카테고리 | RF Modules | RF Modules |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $10.50 | $8.95 |
| Product Type | Sigfox-certified RF transceiver module | Sigfox RF Transceiver Module |
| Manufacturer | TD next (Telecom Design) | Telecom Design / TD next |
| RF Protocol | Sigfox (Ultra-Narrow-Band LPWAN) | — |
| Operating Frequency (RC1) | 868 MHz (ETSI Europe) | — |
| Operating Frequency (RC2) | 902-928 MHz (US, Australia, Japan) | — |
| Tx Power (RC1) | +14 dBm typical | — |
| Tx Power (RC2) | +22 dBm maximum | — |
| Receiver Sensitivity | [DATA_NEEDED: receiver sensitivity] | — |
| Integrated Microcontroller | ARM Cortex-M0+ (STM32 family) | — |
| Clock Reference | Integrated TCXO | — |
| Host Interface | UART, SPI, I2C, GPIO | UART (AT commands), SPI, GPIO |
| Modulation | Ultra-Narrow-Band (UNB), DBPSK uplink | Sigfox ultra-narrowband (UNB) |
| Maximum Payload Size | 12 bytes per uplink message | — |
| 공급 전압 | [DATA_NEEDED: VBAT operating range] | 3.3 V typical (single rail) |
| 동작 온도 | -40C to +85C | -30 C to +70 C |
| Form Factor | Surface-mount LGA castellation module | Surface-mount module |
| 실장 유형 | Surface Mount (reflow) | SMT (castellated edge pads) |
| RoHS 상태 | Compliant | Compliant |
| Operating Frequency Bands | — | 868 MHz (ETSI) / 902 MHz (FCC) |
| Protocol | — | Sigfox (RC1 / RC2 / RC3 / RC4 zone-ready) |
| RX Sensitivity (typical) | — | -126 dBm |
| TX Output Power (max) | — | +14 dBm |
| Baseband Processor | — | ARM Cortex-M3 |
| Antenna Interface | — | SMA / U.FL footprint (model dependent) |