TD1205 vs TD1207 Comparación
Comparación detallada lado a lado de TD1205 por TD next y TD1207 por TD next. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | TD1205 | TD1207 |
|---|---|---|
| Marca | TD next | TD next |
| Categoría | RF Modules | RF Modules |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10,50 | $8,95 |
| Product Type | Sigfox-certified RF transceiver module | Sigfox RF Transceiver Module |
| Manufacturer | TD next (Telecom Design) | Telecom Design / TD next |
| RF Protocol | Sigfox (Ultra-Narrow-Band LPWAN) | — |
| Operating Frequency (RC1) | 868 MHz (ETSI Europe) | — |
| Operating Frequency (RC2) | 902-928 MHz (US, Australia, Japan) | — |
| Tx Power (RC1) | +14 dBm typical | — |
| Tx Power (RC2) | +22 dBm maximum | — |
| Receiver Sensitivity | [DATA_NEEDED: receiver sensitivity] | — |
| Integrated Microcontroller | ARM Cortex-M0+ (STM32 family) | — |
| Clock Reference | Integrated TCXO | — |
| Host Interface | UART, SPI, I2C, GPIO | UART (AT commands), SPI, GPIO |
| Modulation | Ultra-Narrow-Band (UNB), DBPSK uplink | Sigfox ultra-narrowband (UNB) |
| Maximum Payload Size | 12 bytes per uplink message | — |
| Tensión de alimentación | [DATA_NEEDED: VBAT operating range] | 3.3 V typical (single rail) |
| Temperatura de funcionamiento | -40C to +85C | -30 C to +70 C |
| Form Factor | Surface-mount LGA castellation module | Surface-mount module |
| Tipo de montaje | Surface Mount (reflow) | SMT (castellated edge pads) |
| Estado RoHS | Compliant | Compliant |
| Operating Frequency Bands | — | 868 MHz (ETSI) / 902 MHz (FCC) |
| Protocol | — | Sigfox (RC1 / RC2 / RC3 / RC4 zone-ready) |
| RX Sensitivity (typical) | — | -126 dBm |
| TX Output Power (max) | — | +14 dBm |
| Baseband Processor | — | ARM Cortex-M3 |
| Antenna Interface | — | SMA / U.FL footprint (model dependent) |