TMS320C6678ACYPA vs TMS320C6678ACYPA25 Vergleich
Detaillierter Direktvergleich von TMS320C6678ACYPA von Texas Instruments und TMS320C6678ACYPA25 von Texas Instruments. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Texas Instruments
TMS320C6678ACYPA - Octo-Core C66x DSP 1.25GHz | Texas Instruments
TMS320C6678ACYPA ✓ AktivTexas Instruments
TMS320C6678ACYPA25 - Octo-Core C66x DSP 1.25GHz | Texas Instruments
TMS320C6678ACYPA25 ✓ AktivSpezifikationsvergleich
| Parameter | TMS320C6678ACYPA | TMS320C6678ACYPA25 |
|---|---|---|
| Marke | Texas Instruments | Texas Instruments |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $226,49 | $410,42 |
| Core Type | C66x fixed/floating-point DSP | — |
| Number of Cores | 8 | — |
| Maximale Taktfrequenz | 1.25 GHz | — |
| Aggregate Performance | up to 10 GHz (octo-core) | — |
| Architecture | KeyStone multicore SoC | — |
| On-Chip L2 Memory | 4 MB | — |
| L1 Memory per Core | 32 KB L1P + 32 KB L1D | — |
| External Memory Interface | 64-bit DDR3 | 64-bit DDR3 EMIF with ECC, up to 8 GB addressable |
| Peripherals | Hyperlink, SRIO, EMAC, EMIF16 | — |
| Versorgungsspannung | [DATA_NEEDED: core and I/O supply voltage ranges] | — |
| Betriebstemperatur | -40C to +100C | — |
| Gehäuse | 841-pin FCBGA (CYP), 24x24 mm | FCBGA-841 (CYP) 24x24 mm |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Speed Grade Code | ACY = 1.0 GHz to 1.25 GHz family | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL level] |
| Typical Power Dissipation | [DATA_NEEDED: typical power at 1.25 GHz] | — |
| Device Type | — | Digital Signal Processor (DSP) - Fixed/Floating Point |
| Core Architecture | — | C66x (8 cores) |
| Maximum Core Frequency | — | 1.25 GHz |
| Betriebstemperaturbereich | — | -40 C to +100 C |
| L1 Program Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| L2 Cache (per core) | — | 512 KB (configurable as cache/SRAM, with ECC) |
| High-Speed Serial Interfaces | — | 4x Serial RapidIO v2.1, 2x PCIe Gen2, HyperLink (50 Gbaud), 2x SGMII Gigabit Ethernet |
| Other Peripherals | — | I2C, SPI, UART, GPIO, 16x 64-bit timers, EMIF16 (NAND/NOR), Telecom Serial Interface Port |
| Process Technology | — | 40 nm CMOS |
| Core Supply Voltage | — | 1.0 V |
| I/O Supply Voltages | — | 1.5 V / 1.8 V |
| Approximate Power Dissipation | — | 5-10 W typical load (depends on core activity) |
| ECC Support | — | Yes (L2 cache, DDR3 EMIF) |