TMS320C6678ACYPA vs TMS320C6678ACYPA25 Comparaison
Comparaison détaillée côte à côte de TMS320C6678ACYPA par Texas Instruments et TMS320C6678ACYPA25 par Texas Instruments. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Texas Instruments
TMS320C6678ACYPA - Octo-Core C66x DSP 1.25GHz | Texas Instruments
TMS320C6678ACYPA ✓ ActifTexas Instruments
TMS320C6678ACYPA25 - Octo-Core C66x DSP 1.25GHz | Texas Instruments
TMS320C6678ACYPA25 ✓ ActifComparaison des spécifications
| Paramètre | TMS320C6678ACYPA | TMS320C6678ACYPA25 |
|---|---|---|
| Marque | Texas Instruments | Texas Instruments |
| Catégorie | DSP | DSP |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $226,49 | $410,42 |
| Core Type | C66x fixed/floating-point DSP | — |
| Number of Cores | 8 | — |
| Fréquence d'horloge maximale | 1.25 GHz | — |
| Aggregate Performance | up to 10 GHz (octo-core) | — |
| Architecture | KeyStone multicore SoC | — |
| On-Chip L2 Memory | 4 MB | — |
| L1 Memory per Core | 32 KB L1P + 32 KB L1D | — |
| External Memory Interface | 64-bit DDR3 | 64-bit DDR3 EMIF with ECC, up to 8 GB addressable |
| Peripherals | Hyperlink, SRIO, EMAC, EMIF16 | — |
| Tension d'alimentation | [DATA_NEEDED: core and I/O supply voltage ranges] | — |
| Température de fonctionnement | -40C to +100C | — |
| Boîtier | 841-pin FCBGA (CYP), 24x24 mm | FCBGA-841 (CYP) 24x24 mm |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Speed Grade Code | ACY = 1.0 GHz to 1.25 GHz family | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Niveau MSL | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL level] |
| Typical Power Dissipation | [DATA_NEEDED: typical power at 1.25 GHz] | — |
| Device Type | — | Digital Signal Processor (DSP) - Fixed/Floating Point |
| Core Architecture | — | C66x (8 cores) |
| Maximum Core Frequency | — | 1.25 GHz |
| Plage de température de fonctionnement | — | -40 C to +100 C |
| L1 Program Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| L2 Cache (per core) | — | 512 KB (configurable as cache/SRAM, with ECC) |
| High-Speed Serial Interfaces | — | 4x Serial RapidIO v2.1, 2x PCIe Gen2, HyperLink (50 Gbaud), 2x SGMII Gigabit Ethernet |
| Other Peripherals | — | I2C, SPI, UART, GPIO, 16x 64-bit timers, EMIF16 (NAND/NOR), Telecom Serial Interface Port |
| Process Technology | — | 40 nm CMOS |
| Core Supply Voltage | — | 1.0 V |
| I/O Supply Voltages | — | 1.5 V / 1.8 V |
| Approximate Power Dissipation | — | 5-10 W typical load (depends on core activity) |
| ECC Support | — | Yes (L2 cache, DDR3 EMIF) |