TMS320C6678ACYPA vs TMS320C6678ACYPA25 Comparação
Comparação detalhada lado a lado de TMS320C6678ACYPA por Texas Instruments e TMS320C6678ACYPA25 por Texas Instruments. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Texas Instruments
TMS320C6678ACYPA - Octo-Core C66x DSP 1.25GHz | Texas Instruments
TMS320C6678ACYPA ✓ AtivoTexas Instruments
TMS320C6678ACYPA25 - Octo-Core C66x DSP 1.25GHz | Texas Instruments
TMS320C6678ACYPA25 ✓ AtivoComparação de especificações
| Parâmetro | TMS320C6678ACYPA | TMS320C6678ACYPA25 |
|---|---|---|
| Marca | Texas Instruments | Texas Instruments |
| Categoria | DSP | DSP |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $226,49 | $410,42 |
| Core Type | C66x fixed/floating-point DSP | — |
| Number of Cores | 8 | — |
| Frequência máxima de clock | 1.25 GHz | — |
| Aggregate Performance | up to 10 GHz (octo-core) | — |
| Architecture | KeyStone multicore SoC | — |
| On-Chip L2 Memory | 4 MB | — |
| L1 Memory per Core | 32 KB L1P + 32 KB L1D | — |
| External Memory Interface | 64-bit DDR3 | 64-bit DDR3 EMIF with ECC, up to 8 GB addressable |
| Peripherals | Hyperlink, SRIO, EMAC, EMIF16 | — |
| Tensão de alimentação | [DATA_NEEDED: core and I/O supply voltage ranges] | — |
| Temperatura de operação | -40C to +100C | — |
| Encapsulamento | 841-pin FCBGA (CYP), 24x24 mm | FCBGA-841 (CYP) 24x24 mm |
| Tipo de montagem | Surface Mount | Surface Mount (BGA) |
| Speed Grade Code | ACY = 1.0 GHz to 1.25 GHz family | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Nível MSL | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL level] |
| Typical Power Dissipation | [DATA_NEEDED: typical power at 1.25 GHz] | — |
| Device Type | — | Digital Signal Processor (DSP) - Fixed/Floating Point |
| Core Architecture | — | C66x (8 cores) |
| Maximum Core Frequency | — | 1.25 GHz |
| Faixa de temperatura de operação | — | -40 C to +100 C |
| L1 Program Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| L2 Cache (per core) | — | 512 KB (configurable as cache/SRAM, with ECC) |
| High-Speed Serial Interfaces | — | 4x Serial RapidIO v2.1, 2x PCIe Gen2, HyperLink (50 Gbaud), 2x SGMII Gigabit Ethernet |
| Other Peripherals | — | I2C, SPI, UART, GPIO, 16x 64-bit timers, EMIF16 (NAND/NOR), Telecom Serial Interface Port |
| Process Technology | — | 40 nm CMOS |
| Core Supply Voltage | — | 1.0 V |
| I/O Supply Voltages | — | 1.5 V / 1.8 V |
| Approximate Power Dissipation | — | 5-10 W typical load (depends on core activity) |
| ECC Support | — | Yes (L2 cache, DDR3 EMIF) |