W25X40CLZPIG vs W25X40CLZPIG-TR Vergleich
Detaillierter Direktvergleich von W25X40CLZPIG von Winbond und W25X40CLZPIG-TR von Winbond. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | W25X40CLZPIG | W25X40CLZPIG-TR |
|---|---|---|
| Marke | Winbond | Winbond |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,58 | $0,49 |
| Speichertyp | NOR Flash | Non-Volatile NOR Flash |
| Speichergröße | 4 Mbit (512K x 8) | 4 Mbit (512 Kbit x 8) |
| Schnittstelle | SPI, Dual-SPI, Quad-SPI | — |
| Maximale Taktfrequenz | 104 MHz | — |
| Sector Size | 4 KB uniform | 4 KB (uniform sector) |
| Page Size | 256 bytes | — |
| Access Time | 8 ns | 8 ns |
| Versorgungsspannung | 2.5 V to 3.3 V | — |
| Gehäuse | 8-WSON (6x5 mm) with exposed pad | 8-WSON (6 x 5 mm) with Exposed Pad |
| Pin-Anzahl | 8 | — |
| Betriebstemperatur | -40C to +85C | -40C to +85C |
| Sector Erase Time | 40 ms typical | — |
| Page Program Time | 1.4 ms typical | — |
| Write Protection | Hardware /WP pin + software STATUS register | Hardware (/WP pin) and Software (status register) |
| RoHS-Status | Compliant | Compliant (per Winbond product page) |
| Montageart | Surface Mount | Surface Mount |
| JEDEC ID Read | Yes (0xEF3013 manufacturer/device) | — |
| Memory Organization | — | 512K x 8 |
| Memory Interface | — | SPI (Standard and Dual SPI) |
| Maximum SPI Clock Frequency | — | 104 MHz |
| Operating Voltage | — | 2.5 V / 3.3 V |
| Block Erase Sizes | — | 32 KB and 64 KB |
| Page Program Size | — | Up to 256 bytes per command |
| Package Designator | — | ZP |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |