XC6SLX75-2FGG484I vs XC6SLX75-2FG484I Vergleich

Detaillierter Direktvergleich von XC6SLX75-2FGG484I von AMD und XC6SLX75-2FG484I von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter XC6SLX75-2FGG484I XC6SLX75-2FG484I
Marke AMD AMD
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Device Family Spartan-6 LX —
Logic Cells 74,637 —
Logic Elements / Slices 11,650 slices —
System Gates 3,170,304 —
Block RAM 4,824 Kbits (180 x 18 Kbit) —
DSP Slices (DSP48A1) 132 —
User I/Os 280 —
Maximum Internal Frequency 667 MHz —
Process Technology 45 nm CMOS —
Core Supply Voltage (VCCINT) 1.14 V to 1.26 V —
Auxiliary Supply Voltage (VCCAUX) 3.3 V —
Speed Grade -2 (mid-range) -2
Gehäuse 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch —
Operating Temperature (Industrial) -40 °C to +100 °C (junction to +125 °C) —
Montageart Surface Mount (BGA) —
MSL-Level 3 (168 hours) —
RoHS-Status Compliant [DATA_NEEDED: RoHS status]
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Spartan-6 LX
Manufacturer — AMD / Xilinx
Logic Elements — 74,637 LE
Logic Blocks — 5,831
Internal Frequency — 667 MHz
I/O Count — 280 I/O
Package Type — FCBGA-484 / 484-BBGA
Number of Terminals — 484 balls
Package Dimensions — 23 mm x 23 mm
Ball Pitch — 1 mm
Package Outline — MS-034
Temperature Grade — Industrial
Betriebstemperatur — 0°C to +85°C (32°F to 185°F)
Terminal Form — Ball
Package Shape — Square
Configuration Memory — [DATA_NEEDED: configuration memory capacity]
Block RAM Capacity — [DATA_NEEDED: block RAM capacity]
DSP Resources — [DATA_NEEDED: DSP resource count]
Core Supply Voltage — [DATA_NEEDED: core supply voltage]

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