XC6SLX75-2FGG484I vs XC6SLX75-2FG484I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX75-2FGG484I sa pamamagitan ng AMD at XC6SLX75-2FG484I sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
AMD
XC6SLX75-2FGG484I - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
XC6SLX75-2FGG484I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | XC6SLX75-2FGG484I | XC6SLX75-2FG484I |
|---|---|---|
| Brand | AMD | AMD |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Family | Spartan-6 LX | — |
| Logic Cells | 74,637 | — |
| Logic Elements / Slices | 11,650 slices | — |
| System Gates | 3,170,304 | — |
| Block RAM | 4,824 Kbits (180 x 18 Kbit) | — |
| DSP Slices (DSP48A1) | 132 | — |
| User I/Os | 280 | — |
| Maximum Internal Frequency | 667 MHz | — |
| Process Technology | 45 nm CMOS | — |
| Core Supply Voltage (VCCINT) | 1.14 V to 1.26 V | — |
| Auxiliary Supply Voltage (VCCAUX) | 3.3 V | — |
| Speed Grade | -2 (mid-range) | -2 |
| Packhaging | 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch | — |
| Operating Temperature (Industrial) | -40 °C to +100 °C (junction to +125 °C) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Level ng MSL | 3 (168 hours) | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Spartan-6 LX |
| Manufacturer | — | AMD / Xilinx |
| Logic Elements | — | 74,637 LE |
| Logic Blocks | — | 5,831 |
| Internal Frequency | — | 667 MHz |
| I/O Count | — | 280 I/O |
| Package Type | — | FCBGA-484 / 484-BBGA |
| Number of Terminals | — | 484 balls |
| Package Dimensions | — | 23 mm x 23 mm |
| Ball Pitch | — | 1 mm |
| Package Outline | — | MS-034 |
| Temperature Grade | — | Industrial |
| Temperature na Operasyon | — | 0°C to +85°C (32°F to 185°F) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Configuration Memory | — | [DATA_NEEDED: configuration memory capacity] |
| Block RAM Capacity | — | [DATA_NEEDED: block RAM capacity] |
| DSP Resources | — | [DATA_NEEDED: DSP resource count] |
| Core Supply Voltage | — | [DATA_NEEDED: core supply voltage] |