XC6SLX75-3FGG676C vs XC6SLX100-2FGG676C Vergleich

Detaillierter Direktvergleich von XC6SLX75-3FGG676C von Xilinx und XC6SLX100-2FGG676C von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter XC6SLX75-3FGG676C XC6SLX100-2FGG676C
Marke Xilinx AMD
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Device Type FPGA (Field Programmable Gate Array) —
FPGA Family Spartan-6 LX —
Logic Cells 74,637 101,261
Configurable Logic Blocks (CLBs) 5,831 —
User I/O 408 —
DSP48A1 Slices 132 —
Block RAM 3,096 Kbit 3.8 Mb (4824 Kbits)
Internal Frequency 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table) —
Versorgungsspannung 1.14 V to 1.26 V —
Process Technology 45 nm CMOS 45 nm CMOS
Speed Grade -3 (highest performance grade) -2
Betriebstemperatur 0 C to 85 C (commercial) —
Package Type FBGA-676 (PBGA676) —
Package Dimensions 27 mm x 27 mm, 1.0 mm ball pitch —
Montageart Surface Mount Surface Mount (BGA)
Clock Management DCM and PLL present —
Lead-Free Yes —
RoHS [DATA_NEEDED: RoHS compliance statement for this exact orderable] —
REACH [DATA_NEEDED: REACH declaration for this exact orderable] —
Automotive Grade (AEC-Q100) Not qualified - commercial temperature grade —
Maximum Package Pin Count 676 balls —
Family — Spartan-6 LX
System Gates — 4,939,776
Slices — 15,822
DSP Slices — 180 DSP48A1
Maximum User I/O — 480
Maximum I/O Banks — 6
Temperature Grade — Commercial (0 C to +85 C)
Gehäuse — FBGA-676 (FGG676) 27x27 mm
Ball Pitch — 0.8 mm
Core Voltage — 1.2 V
RoHS-Status — Compliant
Lead Free — Yes

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