XC6SLX75-3FGG676C vs XC6SLX100-2FGG676C 对比
详细并排对比 XC6SLX75-3FGG676C 出自 Xilinx 和 XC6SLX100-2FGG676C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX75-3FGG676C | XC6SLX100-2FGG676C |
|---|---|---|
| 品牌 | Xilinx | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| FPGA Family | Spartan-6 LX | — |
| Logic Cells | 74,637 | 101,261 |
| Configurable Logic Blocks (CLBs) | 5,831 | — |
| User I/O | 408 | — |
| DSP48A1 Slices | 132 | — |
| Block RAM | 3,096 Kbit | 3.8 Mb (4824 Kbits) |
| Internal Frequency | 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table) | — |
| 电源电压 | 1.14 V to 1.26 V | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Speed Grade | -3 (highest performance grade) | -2 |
| 工作温度 | 0 C to 85 C (commercial) | — |
| Package Type | FBGA-676 (PBGA676) | — |
| Package Dimensions | 27 mm x 27 mm, 1.0 mm ball pitch | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Clock Management | DCM and PLL present | — |
| Lead-Free | Yes | — |
| RoHS | [DATA_NEEDED: RoHS compliance statement for this exact orderable] | — |
| REACH | [DATA_NEEDED: REACH declaration for this exact orderable] | — |
| Automotive Grade (AEC-Q100) | Not qualified - commercial temperature grade | — |
| Maximum Package Pin Count | 676 balls | — |
| Family | — | Spartan-6 LX |
| System Gates | — | 4,939,776 |
| Slices | — | 15,822 |
| DSP Slices | — | 180 DSP48A1 |
| Maximum User I/O | — | 480 |
| Maximum I/O Banks | — | 6 |
| Temperature Grade | — | Commercial (0 C to +85 C) |
| 封装 | — | FBGA-676 (FGG676) 27x27 mm |
| Ball Pitch | — | 0.8 mm |
| Core Voltage | — | 1.2 V |
| RoHS 状态 | — | Compliant |
| Lead Free | — | Yes |