XC6SLX75-3FGG676C vs XC6SLX100-2FGG676C Comparação
Comparação detalhada lado a lado de XC6SLX75-3FGG676C por Xilinx e XC6SLX100-2FGG676C por AMD. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Xilinx
XC6SLX75-3FGG676C - Spartan-6 LX FPGA, 74637 Cells, 408 I/O | Xilinx
XC6SLX75-3FGG676C ✓ AtivoComparação de especificações
| Parâmetro | XC6SLX75-3FGG676C | XC6SLX100-2FGG676C |
|---|---|---|
| Marca | Xilinx | AMD |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| FPGA Family | Spartan-6 LX | — |
| Logic Cells | 74,637 | 101,261 |
| Configurable Logic Blocks (CLBs) | 5,831 | — |
| User I/O | 408 | — |
| DSP48A1 Slices | 132 | — |
| Block RAM | 3,096 Kbit | 3.8 Mb (4824 Kbits) |
| Internal Frequency | 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table) | — |
| Tensão de alimentação | 1.14 V to 1.26 V | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Speed Grade | -3 (highest performance grade) | -2 |
| Temperatura de operação | 0 C to 85 C (commercial) | — |
| Package Type | FBGA-676 (PBGA676) | — |
| Package Dimensions | 27 mm x 27 mm, 1.0 mm ball pitch | — |
| Tipo de montagem | Surface Mount | Surface Mount (BGA) |
| Clock Management | DCM and PLL present | — |
| Lead-Free | Yes | — |
| RoHS | [DATA_NEEDED: RoHS compliance statement for this exact orderable] | — |
| REACH | [DATA_NEEDED: REACH declaration for this exact orderable] | — |
| Automotive Grade (AEC-Q100) | Not qualified - commercial temperature grade | — |
| Maximum Package Pin Count | 676 balls | — |
| Family | — | Spartan-6 LX |
| System Gates | — | 4,939,776 |
| Slices | — | 15,822 |
| DSP Slices | — | 180 DSP48A1 |
| Maximum User I/O | — | 480 |
| Maximum I/O Banks | — | 6 |
| Temperature Grade | — | Commercial (0 C to +85 C) |
| Encapsulamento | — | FBGA-676 (FGG676) 27x27 mm |
| Ball Pitch | — | 0.8 mm |
| Core Voltage | — | 1.2 V |
| Status RoHS | — | Compliant |
| Lead Free | — | Yes |