10AS066H3F34I2SG - Arria 10 SX SoC FPGA 660K LE | Intel | 1152-FBGA
Teilenummer: 10AS066H3F34I2SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4199.6711 | $4.199,67 |
| 10 | $3950 | $39.500,00 |
| 100 | $3700 | $370.000,00 |
| 500 | $3450 | $1.725.000,00 |
| 1.000 | $3200 | $3.200.000,00 |
10AS066H3F34I2SG Übersicht
An SoC FPGA is a single device that pairs a traditional field-programmable gate array fabric with one or more hard processor cores and dedicated peripherals, allowing hardware-accelerated DSP, memory, and I/O functions to run alongside deterministic software execution. The Arria 10 SX family specifically targets mid- to high-bandwidth applications such as wireless baseband, broadcast, military radar, and medical imaging, occupying the performance envelope between Cyclone V/10 and Stratix 10 devices in Intel's portfolio.
Key features include 660K logic elements, integrated dual-core ARM Cortex-A9 MPCore with CoreSight debug, hard memory controllers, high-speed transceivers supporting multi-gigabit serial protocols, and the 1152-ball FCBGA (F34) package that exposes the full I/O and transceiver channel count. The 20 nm process enables a favorable power/performance ratio, and the industrial temperature grade (-40C to +100C) allows deployment in harsh-environment applications.
Architecturally, the SoC combines the FPGA fabric with a coherent Cortex-A9 subsystem, enabling a unified address space and efficient data movement between accelerators implemented in programmable logic and software tasks running on the cores. The 1.5 GHz core frequency, hardened peripherals (EMAC, USB, NAND flash controller), and rich transceiver lane count make the device suitable for protocols such as PCIe Gen3, 10 Gigabit Ethernet, and serial RapidIO.
Typical applications include wireless baseband processing in LTE/5G small cells, broadcast video encoders and transcoders, military radar and electronic-warfare signal chains, medical imaging pre-processing, and high-performance industrial vision systems. The HPS subsystem also makes the device useful as a control-plane plus data-plane platform where deterministic FPGA pipelines are coupled with a Linux- or RTOS-managed software stack.
Designers should plan PCB layout around the 35x35 mm FCBGA ball array with matched-impedance routing for high-speed transceivers, a multi-rail decoupling strategy, and a thermal solution sized for industrial-grade operation. Quartus Prime is the design-entry and synthesis environment and should be configured for the SX device variant early in the flow.
Drop-in-Alternativen für 10AS066H3F34I2SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS066H3F34I2SG (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Logic Elements, Temperature Grade, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS066H3F34I2LG
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →10AS066H3F34E2SG
✅ Drop-In✓ Auf Lager
$3600 / Stück
Datenblatt ansehen →10AS066H2F34I2SG
✅ Drop-In✓ Auf Lager
$3550 / Stück
Datenblatt ansehen →10AS066H2F34I2LG
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$11050 / Stück
Datenblatt ansehen →10AS066H2F34E2SG
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$2400 / Stück
Datenblatt ansehen →10AS066H1F34I1HG
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$3720 / Stück
Datenblatt ansehen →10AS066H1F34E1HG
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$3900 / Stück
Datenblatt ansehen →10AS066H3F34I2SG Grenzwerte & elektrische Eigenschaften
| Device Family | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 |
| Process Node | 20 nm |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Core Frequency | 1.5 GHz |
| User I/O Count | 492 |
| Gehäuse | 1152-FBGA, FC (F34) 35x35 mm |
| Versorgungsspannung | 0.9 V core |
| Temperature Grade | Industrial |
| Betriebstemperatur | -40C to +100C |
| Montageart | Surface Mount (BGA) |
| Memory Controllers | Hard DDR3/DDR4 controller in HPS and FPGA fabric |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
10AS066H3F34I2SG 1152-fbga, fc (f34) 35x35 mm Pinbelegungsleitfaden
Pinbelegung für 10AS066H3F34I2SG (1152-fbga, fc (f34) 35x35 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS066H3F34I2SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS066H3F34I2SG ist geeignet für 6 Anwendungs: Wireless Baseband Processing, Broadcast Video Encoder/Transcoder, Military Radar and Electronic Warfare, Medical Imaging Pre-Processing, Industrial Machine Vision, Embedded Compute Platform (HPS-centric).
Wireless Baseband Processing
The 10AS066H3F34I2SG is well suited for LTE and 5G small-cell baseband processing because its 660K logic elements and H3-grade transceivers support multi-antenna MIMO datapaths and high-rate CPRI/OBSAI links. With 1.5 GHz dual-core Cortex-A9 HPS, designers can host the PHY control plane on Linux/RTOS while implementing time‑critical DSP blocks in FPGA fabric. The 492 user I/O and hardened PCIe Gen3 blocks ease fronthaul connectivity to baseband cards.
Empfohlen
Broadcast Video Encoder/Transcoder
Broadcast video encoders benefit from the 10AS066H3F34I2SG's combination of high logic density for HEVC/H.264 pipeline blocks and a 1.5 GHz Cortex-A9 subsystem for transport-stream muxing and IP control. The H3 transceiver rate enables uncompressed 3G-SDI and SMPTE 2022-6/2110 IP video ingest over 10 Gigabit Ethernet. Industrial temperature grade supports outside-broadcast and studio equipment racks without extra thermal screening.
Empfohlen
Military Radar and Electronic Warfare
Phased-array radar and electronic-warfare subsystems leverage the 10AS066H3F34I2SG's combination of 660K logic elements, hardened DSP blocks, and multi-gigabit transceivers to process wideband I/Q data from ADC arrays. The Cortex-A9 HPS runs the real-time task scheduler while FPGA fabric handles FFT, pulse compression, and beamforming in deterministic hardware. The F34 1152-ball FCBGA provides the I/O density required for many ADC/DAC lanes on a single board.
Empfohlen
Medical Imaging Pre-Processing
Ultrasound and CT imaging pre-processing pipelines map naturally onto the 10AS066H3F34I2SG's parallel fabric. Beamforming, FIR filtering, and image reconstruction accelerate on the programmable logic, while the Cortex-A9 HPS handles the user interface, DICOM stack, and post-processing. The industrial temperature rating and lead-free F34 package meet medical device compliance requirements, and the 492 user I/O accommodate high-channel-count ADC front ends.
Empfohlen
Industrial Machine Vision
High-speed production-line inspection systems use the 10AS066H3F34I2SG to process multi-camera 10 GigE Vision streams in parallel FPGA pipelines. The dual-core Cortex-A9 HPS runs the vision application's decision logic, while the FPGA fabric performs Bayer demosaicing, defect detection, and 25 Gbps uplink aggregation. The F34 FCBGA's high ball count allows multi-channel sensor fan-in without external aggregation ASICs.
Empfohlen
Embedded Compute Platform (HPS-centric)
Designers building control-plane plus data-plane products can use the 10AS066H3F34I2SG as a Linux/RTOS host with FPGA accelerators. The Cortex-A9 MPCore runs the application stack, while FPGA fabric offloads packet processing, cryptography, or DSP. The 1152-ball F34 FCBGA provides the I/O and transceiver bandwidth needed for industrial Ethernet, PCIe Gen3, and high-speed memory interfaces on a single board.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS066H3F34I2SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS066H3F34I2LG | 10AS066H3F34E2SG | 10AS066H2F34I2SG | 10AS066H2F34I2LG | 10AS066H2F34E2SG | 10AS066H1F34I1HG |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-FBGA, FC (F34) 35x35 mm | 1152-FBGA, FC (F34) 35x35 mm - same | 1152-FBGA, FC (F34) 35x35 mm - same | 1152-FBGA, FC (F34) 35x35 mm - same | 1152-FBGA, FC (F34) 35x35 mm - same | 1152-FBGA, FC (F34) 35x35 mm - same | 1152-FBGA, FC (F34) 35x35 mm - same |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Transceiver Speed Grade | H3 | H3 | H3 | H2 | H2 | H2 | H1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Enhanced (-40C to +125C) | Industrial | Industrial | Enhanced | Industrial |
| HPS Cores | Dual-core ARM Cortex-A9 @ 1.5 GHz | Dual-core ARM Cortex-A9 @ 1.5 GHz | Dual-core ARM Cortex-A9 @ 1.5 GHz | Dual-core ARM Cortex-A9 @ 1.5 GHz | Dual-core ARM Cortex-A9 @ 1.5 GHz | Dual-core ARM Cortex-A9 @ 1.5 GHz | Dual-core ARM Cortex-A9 @ 1.5 GHz |
| User I/O Count | 492 | 492 | 492 | 492 | 492 | 492 | 492 |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Wichtigste Unterscheidungsmerkmale
- Highest transceiver speed grade (H3) in the 10AS066 family (vs. 10AS066H2F34I2SG)
- Industrial temperature grade (-40C to +100C) with H3 transceivers (vs. 10AS066H3F34E2SG)
- 660K logic elements and 492 user I/O on a 20 nm Arria 10 SX die (vs. 10AS032E3F27I2SG)
Designhinweise
The 1152-ball F34 FCBGA (35x35 mm) demands a high-layer-count PCB (typically 12+ layers) with microvia stackups and matched-length routing for transceiver lanes. Place decoupling capacitors as close to each power ball group as the breakout allows, with separate VCC, VCCPT, VCCA_FPLL, and VCC_HPS rails routed as wide pours. Reference Intel's Arria 10 SX F34 pin-out file and recommended decoupling guideline in Quartus Prime before finalizing stackup.
Estimated: at typical SoC FPGA power of 20-30 W for the 10AS066 with high transceiver utilization, the F34 package requires a heat sink and 200-400 LFM airflow to stay within the 100C industrial junction limit. Use a thermal interface material rated for 3 W/mK or better and a heat spreader across the package top. Estimate: with theta_JA of approximately 1.5 C/W with a typical heat sink at 200 LFM, 25 W dissipation yields a 37.5C rise above ambient, leaving 25C headroom under 100C ambient - sized correctly for industrial deployments.
Do not assume transceiver lanes are preconfigured - Quartus Prime assignments must match the F34 ball map and the PCB routing layer. Power-up sequencing (VCC, VCCPT, VCCA_FPLL, VCC_HPS) must follow the Intel Arria 10 power management guide; failure to sequence correctly causes latch-up. Ensure HPS boot mode strapping pins are pulled correctly for SD/eMMC/NAND boot, and that JTAG chain is properly terminated for boundary-scan and debug access.
Compliance-Informationen
RoHS compliance per Globalspec and Partstack listings of 2026-09. Industrial-grade temperature range. Not AEC-Q100 qualified (industrial FPGAs are typically not AEC-Q100; AEC-Q100 qualification is more common on specific automotive variants).
