10AS066H4F34E3SG - Arria 10 SX SoC FPGA, 660K LE | Altera | 1152-FBGA
Teilenummer: 10AS066H4F34E3SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2374.33 | $2.374,33 |
| 10 | $2280.5 | $22.805,00 |
| 100 | $2150 | $215.000,00 |
| 500 | $2025 | $1.012.500,00 |
| 1.000 | $1920 | $1.920.000,00 |
10AS066H4F34E3SG Übersicht
A System-on-Chip FPGA (SoC FPGA) is a class of embedded integrated circuit that combines a general-purpose processor subsystem with programmable logic on the same die. The processor subsystem (often ARM Cortex-A) handles operating-system-driven tasks such as networking stacks, control planes, and user interfaces, while the FPGA fabric accelerates parallel data-path workloads. SoC FPGAs sit within the broader hierarchy of embedded processors, bridging the gap between standalone microcontrollers and discrete CPU + FPGA multi-chip solutions; they are widely used in wired/wireless communication, industrial vision, and military/aerospace signal processing.
Key features of the 10AS066H4F34E3SG include 660K logic elements, hardware IEEE 754 single-precision floating-point multipliers, embedded 20 Gbps transceivers suitable for PCIe Gen3, 10 GbE, and CPRI links, and up to approximately 50 Mb of on-chip RAM. The HPS side includes dual Cortex-A9 cores with NEON media engine, 32 KB I-cache and 32 KB D-cache per core, 512 KB shared L2, and integrated DDR3/DDR4 controller with ECC. Hard memory controllers and PCI Express Gen3 endpoints reduce soft-logic utilization and improve timing closure.
Typical applications include 4K video broadcast encoders, wireless baseband processing for LTE small cells, radar and electronic-warfare front-ends, medical imaging pipelines, and high-performance industrial inspection. The combination of ARM software ecosystem with FPGA-class DSP throughput is the primary architectural advantage over either a discrete CPU or a pure FPGA solution.
When designing with the F34 (35x35 mm FCBGA) package, allocate dedicated ground and high-current power planes, follow Intel/Altera's pin-out guidelines for transceiver reference clocks, and validate the thermal envelope against the application-specific SoC power dissipation. Refer to the manufacturer datasheet for full transceiver characterization and HPS boot sequence timing.
Drop-in-Alternativen für 10AS066H4F34E3SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS066H4F34E3SG (gleiche Bauform und Footprint) – abweichend in Mounting Type, Package, Operating Temperature, Temperature Grade, Core Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS066H3F34E2SG
✅ Drop-In✓ Auf Lager
$3600 / Stück
Datenblatt ansehen →10AS066H4F34E3LG
✅ Drop-In✓ Auf Lager
$2419.49 / Stück
Datenblatt ansehen →10AS057H4F34E3SG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10AS066H4F34I3SG
✅ Drop-In✓ Auf Lager
$2295 / Stück
Datenblatt ansehen →10AS066H2F34E2SG
✅ Drop-In✓ Auf Lager
$2400 / Stück
Datenblatt ansehen →10AS066H3F34I2SG
✅ Drop-In✓ Auf Lager
$3200 / Stück
Datenblatt ansehen →10AS066H4F34E3SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX |
| Logic Elements | 660,000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | 1.5 GHz |
| Gehäuse | 1152-FBGA, FC (35x35 mm) |
| Package Code | F34 |
| Montageart | Surface Mount |
| Maximum User I/O | 492 |
| RoHS-Status | Compliant |
10AS066H4F34E3SG f34 Pinbelegungsleitfaden
Pinbelegung für 10AS066H4F34E3SG (f34-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS066H4F34E3SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS066H4F34E3SG ist geeignet für 6 Anwendungs: 4K Video Broadcast Encoder, Wireless Baseband Processing (LTE Small Cell), Radar and Electronic Warfare Front-End, Medical Imaging Pipeline (CT/MRI Reconstruction), High-Performance Industrial Machine Vision, Avionics Mission Computer.
4K Video Broadcast Encoder
The 10AS066H4F34E3SG fits 4K video broadcast encoder designs because its 660K logic elements, hardware IEEE 754 single-precision DSP blocks, and 20 Gbps transceivers deliver the throughput needed for H.264/H.265 encode at 60 fps with 10-bit color depth. The dual ARM Cortex-A9 HPS runs a Linux OS to manage SMPTE ST 2110 transport streams, NMOS control, and IP packetization, while the FPGA fabric accelerates motion estimation, deblocking filters, and CABAC. Placed on the broadcast motherboard between an HDMI 2.0 input and a 10 GbE SFP+ uplink, the device replaces a discrete CPU plus FPGA, reducing PCB area and power by roughly 30%. Designers should budget for 10 W from the SoC HPS and 20-25 W from the FPGA fabric under peak encode load.
Empfohlen
Wireless Baseband Processing (LTE Small Cell)
For LTE and 5G NR small-cell baseband processing, the 10AS066H4F34E3SG provides the right balance of DSP performance and software control. Its variable-precision DSP blocks implement FFT/iFFT, channel estimation, and MIMO detectors with deterministic latency, while the dual ARM Cortex-A9 HPS runs the Layer 2/3 stack including RRC, PDCP, and GTP-U tunneling. Transceivers support CPRI up to 9.8 Gbps, enabling fronthaul connectivity to a remote radio head. The F34 FCBGA's exposed-die thermal interface allows passive heatsink cooling in an outdoor small-cell enclosure rated -40 to +70C ambient. Compared to a discrete CPU + FPGA design, the integrated SoC reduces PHY-to-MAC latency by roughly 40% due to on-die coherent shared memory.
Empfohlen
Radar and Electronic Warfare Front-End
The 10AS066H4F34E3SG serves radar and electronic-warfare front-ends where hundreds of DSP-intensive channels must be processed in parallel. Its 660K logic elements and hardware IEEE 754 single-precision multipliers deliver up to 1.5 TFLOPs of DSP throughput, sufficient for pulse compression, MTI filtering, and adaptive beamforming on a 32-element phased array. Transceivers support ADC capture up to 12.5 Gbps per lane, with deterministic latency critical for coherent beam-steering. The SoC HPS handles track management, target classification, and Ethernet/Serial RapidIO backhaul. The F34 FCBGA's controlled-impedance transceiver channels simplify PCB stack-up to a 12-layer design. Industrial temperature screening (I-grade) is recommended for outdoor EW pods.
Empfohlen
Medical Imaging Pipeline (CT/MRI Reconstruction)
In CT and MRI image reconstruction, the 10AS066H4F34E3SG accelerates the back-projection and FDK algorithms that turn raw detector data into volumetric images. The 660K logic elements map directly to thousands of parallel multiply-accumulate units, reconstructing a 512x512x256 volume in under one second at clinical throughput. The dual Cortex-A9 HPS handles the patient database interface, DICOM transfer, and reconstruction orchestration. The device's hardware single-precision floating-point DSP matches the IEEE 754 numerical accuracy required for FDA-cleared reconstruction algorithms. Embedded memory (M20K blocks) holds sub-volumes and intermediate sinogram data, while DDR4 attached to the HPS stores reconstructed slices.
Empfohlen
High-Performance Industrial Machine Vision
For high-throughput industrial inspection lines, the 10AS066H4F34E3SG processes 8K line-scan camera data at full throughput. The FPGA fabric ingests multiple CoaXPress or Camera Link channels through transceivers, applies preprocessing (flat-field correction, Bayer demosaic, lens undistortion), then runs convolutional neural network inference for defect classification. The HPS runs a real-time Linux distribution managing GigE Vision output to the factory MES. Compared to GPU-based vision systems, the SoC FPGA approach provides deterministic latency critical for inline reject mechanisms. The F34 FCBGA's industrial operating range (-40 to +100C junction) supports factory-floor deployment without active cooling in many installations.
Empfohlen
Avionics Mission Computer
The 10AS066H4F34E3SG fits avionics mission computers where ARINC 664, MIL-STD-1553, and Fibre Channel must be processed alongside video and sensor fusion. The FPGA fabric implements multiple redundant MIL-STD-1553 BC/RT channels and ARINC 429 receivers with hardware error detection, while the dual Cortex-A9 HPS runs a DO-178C certifiable OS (such as VxWorks 653) hosting mission software. The transceivers support Fibre Channel up to 8 GFC for sensor recorders. The SoC's deterministic boot and BIST features support DO-254 design assurance. The F34 FCBGA is compatible with conduction-cooled chassis used in avionics line replaceable units (LRUs).
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS066H4F34E3SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS066H3F34E2SG | 10AS066H4F34E3LG | 10AS057H4F34E3SG | 10AS066H4F34I3SG | 10AS066H2F34E2SG |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same |
| Logic Elements | 660,000 | 660,000 | 660,000 | 570,000 (-14%) | 660,000 | 660,000 |
| Speed Grade | 4 | 3 (slower) | 4 | 4 | 4 | 2 (slowest) |
| Temperature Grade | E (extended) | E (extended) | E (extended) | E (extended) | I (industrial) | E (extended) |
| HPS Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Process / Core Voltage | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V |
| Maximum User I/O | 492 | 492 | 492 | 492 | 492 | 492 |
Wichtigste Unterscheidungsmerkmale
- Highest logic density in the Arria 10 SX F34 family at the fastest speed grade (vs. 10AS057H4F34E3SG)
- Faster speed grade than lower-numbered OPNs at the same density (vs. 10AS066H3F34E2SG)
- Same-package SoC FPGA with dual ARM Cortex-A9 hard processor (vs. 10AS066H4F34E3LG (lead-free variant))
Designhinweise
The F34 FCBGA's exposed die requires a high-performance thermal interface material (TIM) and either a heat sink or a cold plate for typical SoC FPGA workloads. Estimated: at 30 W total SoC power (15 W HPS + 15 W FPGA fabric), the junction-to-ambient thermal resistance must stay below 1.5 C/W to limit Tj rise to 45 C above a 70 C ambient. Reference the Arria 10 SX Thermal Design Guide for board-level cooling strategies.
The 1152-ball FCBGA F34 package mandates an HDI PCB stack-up with micro-vias and 1 oz copper on outer layers. Transceiver channels require 85 ohm differential impedance with length matching to within 0.127 mm (5 mil). HPS DDR4 traces must follow the byte-by-byte length matching rules in the Arria 10 External Memory Interface Handbook. Use the Altera/Altera F34 PCB footprint library symbol to avoid escape routing congestion on the top layer.
Estimated: total board power including HPS, FPGA fabric at 70% utilization, and transceivers at full data rate is approximately 28-35 W. The 0.9 V core rail requires a multi-phase buck controller with at least 30 A peak current capability and output voltage ripple below 30 mV. Sequence the HPS and FPGA rails per Intel's Arria 10 Power-Up Sequencing Guidelines to avoid in-rush damage.
Do not assume that all Arria 10 SX F34 OPNs are pin-compatible without checking the specific die density column. The H4 prefix indicates 660K LE; selecting an OPN with a different prefix (e.g., 10AS057H4F34E3SG at 570K LE) builds and boots but underutilizes the package's I/O. Always verify the OPN's logic element count matches your firmware configuration in Quartus Prime before committing to PCB layout.
Compliance-Informationen
RoHS compliance per Altera product family page. The SG terminal finish is standard (matte tin over nickel) and contains lead in trace amounts consistent with EU exemptions; for lead-free assembly use the LG variant.