10AS066H4F34E3SG - Arria 10 SX SoC FPGA, 660K LE | Altera | 1152-FBGA
MPN: 10AS066H4F34E3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2374.33 | $2,374.33 |
| 10 | $2280.5 | $22,805.00 |
| 100 | $2150 | $215,000.00 |
| 500 | $2025 | $1,012,500.00 |
| 1,000 | $1920 | $1,920,000.00 |
Drop-in alternatives for 10AS066H4F34E3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS066H3F34E2SG
✅ Drop-In✓ In Stock
$3600 / Unit
View Datasheet →10AS066H4F34E3LG
✅ Drop-In✓ In Stock
$2419.49 / Unit
View Datasheet →10AS057H4F34E3SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS066H4F34I3SG
✅ Drop-In✓ In Stock
$2295 / Unit
View Datasheet →10AS066H2F34E2SG
✅ Drop-In✓ In Stock
$2400 / Unit
View Datasheet →10AS066H3F34I2SG
✅ Drop-In✓ In Stock
$3200 / Unit
View Datasheet →10AS066H4F34E3SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Logic Elements | 660,000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | 1.5 GHz |
| Package | 1152-FBGA, FC (35x35 mm) |
| Package Code | F34 |
| Mounting Type | Surface Mount |
| Maximum User I/O | 492 |
| RoHS Status | Compliant |
10AS066H4F34E3SG f34 Pin Configuration Guide
Complete pinout information for 10AS066H4F34E3SG (f34 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS066H4F34E3SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS066H4F34E3SG is suitable for 6 applications: 4K Video Broadcast Encoder, Wireless Baseband Processing (LTE Small Cell), Radar and Electronic Warfare Front-End, Medical Imaging Pipeline (CT/MRI Reconstruction), High-Performance Industrial Machine Vision, Avionics Mission Computer.
4K Video Broadcast Encoder
The 10AS066H4F34E3SG fits 4K video broadcast encoder designs because its 660K logic elements, hardware IEEE 754 single-precision DSP blocks, and 20 Gbps transceivers deliver the throughput needed for H.264/H.265 encode at 60 fps with 10-bit color depth. The dual ARM Cortex-A9 HPS runs a Linux OS to manage SMPTE ST 2110 transport streams, NMOS control, and IP packetization, while the FPGA fabric accelerates motion estimation, deblocking filters, and CABAC. Placed on the broadcast motherboard between an HDMI 2.0 input and a 10 GbE SFP+ uplink, the device replaces a discrete CPU plus FPGA, reducing PCB area and power by roughly 30%. Designers should budget for 10 W from the SoC HPS and 20-25 W from the FPGA fabric under peak encode load.
Recommended
Wireless Baseband Processing (LTE Small Cell)
For LTE and 5G NR small-cell baseband processing, the 10AS066H4F34E3SG provides the right balance of DSP performance and software control. Its variable-precision DSP blocks implement FFT/iFFT, channel estimation, and MIMO detectors with deterministic latency, while the dual ARM Cortex-A9 HPS runs the Layer 2/3 stack including RRC, PDCP, and GTP-U tunneling. Transceivers support CPRI up to 9.8 Gbps, enabling fronthaul connectivity to a remote radio head. The F34 FCBGA's exposed-die thermal interface allows passive heatsink cooling in an outdoor small-cell enclosure rated -40 to +70C ambient. Compared to a discrete CPU + FPGA design, the integrated SoC reduces PHY-to-MAC latency by roughly 40% due to on-die coherent shared memory.
Recommended
Radar and Electronic Warfare Front-End
The 10AS066H4F34E3SG serves radar and electronic-warfare front-ends where hundreds of DSP-intensive channels must be processed in parallel. Its 660K logic elements and hardware IEEE 754 single-precision multipliers deliver up to 1.5 TFLOPs of DSP throughput, sufficient for pulse compression, MTI filtering, and adaptive beamforming on a 32-element phased array. Transceivers support ADC capture up to 12.5 Gbps per lane, with deterministic latency critical for coherent beam-steering. The SoC HPS handles track management, target classification, and Ethernet/Serial RapidIO backhaul. The F34 FCBGA's controlled-impedance transceiver channels simplify PCB stack-up to a 12-layer design. Industrial temperature screening (I-grade) is recommended for outdoor EW pods.
Recommended
Medical Imaging Pipeline (CT/MRI Reconstruction)
In CT and MRI image reconstruction, the 10AS066H4F34E3SG accelerates the back-projection and FDK algorithms that turn raw detector data into volumetric images. The 660K logic elements map directly to thousands of parallel multiply-accumulate units, reconstructing a 512x512x256 volume in under one second at clinical throughput. The dual Cortex-A9 HPS handles the patient database interface, DICOM transfer, and reconstruction orchestration. The device's hardware single-precision floating-point DSP matches the IEEE 754 numerical accuracy required for FDA-cleared reconstruction algorithms. Embedded memory (M20K blocks) holds sub-volumes and intermediate sinogram data, while DDR4 attached to the HPS stores reconstructed slices.
Recommended
High-Performance Industrial Machine Vision
For high-throughput industrial inspection lines, the 10AS066H4F34E3SG processes 8K line-scan camera data at full throughput. The FPGA fabric ingests multiple CoaXPress or Camera Link channels through transceivers, applies preprocessing (flat-field correction, Bayer demosaic, lens undistortion), then runs convolutional neural network inference for defect classification. The HPS runs a real-time Linux distribution managing GigE Vision output to the factory MES. Compared to GPU-based vision systems, the SoC FPGA approach provides deterministic latency critical for inline reject mechanisms. The F34 FCBGA's industrial operating range (-40 to +100C junction) supports factory-floor deployment without active cooling in many installations.
Recommended
Avionics Mission Computer
The 10AS066H4F34E3SG fits avionics mission computers where ARINC 664, MIL-STD-1553, and Fibre Channel must be processed alongside video and sensor fusion. The FPGA fabric implements multiple redundant MIL-STD-1553 BC/RT channels and ARINC 429 receivers with hardware error detection, while the dual Cortex-A9 HPS runs a DO-178C certifiable OS (such as VxWorks 653) hosting mission software. The transceivers support Fibre Channel up to 8 GFC for sensor recorders. The SoC's deterministic boot and BIST features support DO-254 design assurance. The F34 FCBGA is compatible with conduction-cooled chassis used in avionics line replaceable units (LRUs).
Recommended
Recommended Products Summary
Engineering reference data for 10AS066H4F34E3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS066H3F34E2SG | 10AS066H4F34E3LG | 10AS057H4F34E3SG | 10AS066H4F34I3SG | 10AS066H2F34E2SG |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same |
| Logic Elements | 660,000 | 660,000 | 660,000 | 570,000 (-14%) | 660,000 | 660,000 |
| Speed Grade | 4 | 3 (slower) | 4 | 4 | 4 | 2 (slowest) |
| Temperature Grade | E (extended) | E (extended) | E (extended) | E (extended) | I (industrial) | E (extended) |
| HPS Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Process / Core Voltage | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V |
| Maximum User I/O | 492 | 492 | 492 | 492 | 492 | 492 |
Key Differentiators
- Highest logic density in the Arria 10 SX F34 family at the fastest speed grade (vs 10AS057H4F34E3SG)
- Faster speed grade than lower-numbered OPNs at the same density (vs 10AS066H3F34E2SG)
- Same-package SoC FPGA with dual ARM Cortex-A9 hard processor (vs 10AS066H4F34E3LG (lead-free variant))
Design Notes
The F34 FCBGA's exposed die requires a high-performance thermal interface material (TIM) and either a heat sink or a cold plate for typical SoC FPGA workloads. Estimated: at 30 W total SoC power (15 W HPS + 15 W FPGA fabric), the junction-to-ambient thermal resistance must stay below 1.5 C/W to limit Tj rise to 45 C above a 70 C ambient. Reference the Arria 10 SX Thermal Design Guide for board-level cooling strategies.
The 1152-ball FCBGA F34 package mandates an HDI PCB stack-up with micro-vias and 1 oz copper on outer layers. Transceiver channels require 85 ohm differential impedance with length matching to within 0.127 mm (5 mil). HPS DDR4 traces must follow the byte-by-byte length matching rules in the Arria 10 External Memory Interface Handbook. Use the Altera/Altera F34 PCB footprint library symbol to avoid escape routing congestion on the top layer.
Estimated: total board power including HPS, FPGA fabric at 70% utilization, and transceivers at full data rate is approximately 28-35 W. The 0.9 V core rail requires a multi-phase buck controller with at least 30 A peak current capability and output voltage ripple below 30 mV. Sequence the HPS and FPGA rails per Intel's Arria 10 Power-Up Sequencing Guidelines to avoid in-rush damage.
Do not assume that all Arria 10 SX F34 OPNs are pin-compatible without checking the specific die density column. The H4 prefix indicates 660K LE; selecting an OPN with a different prefix (e.g., 10AS057H4F34E3SG at 570K LE) builds and boots but underutilizes the package's I/O. Always verify the OPN's logic element count matches your firmware configuration in Quartus Prime before committing to PCB layout.
Compliance Information
RoHS compliance per Altera product family page. The SG terminal finish is standard (matte tin over nickel) and contains lead in trace amounts consistent with EU exemptions; for lead-free assembly use the LG variant.
