10AX115N1F45E1SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA
Teilenummer: 10AX115N1F45E1SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $10728.49 | $10.728,49 |
| 10 | $9655.64 | $96.556,40 |
| 100 | $8582.79 | $858.279,00 |
| 500 | $7724.51 | $3.862.255,00 |
| 1.000 | $6866.23 | $6.866.230,00 |
10AX115N1F45E1SG Übersicht
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic, routing, and I/O behaviour can be defined after manufacture using a hardware description language (HDL). FPGAs sit in the semiconductor hierarchy alongside ASICs, ASSPs, microcontrollers, and CPLDs, but unlike CPLDs they target data-parallel workloads such as digital signal processing, packet processing, and high-speed serial I/O. The Arria 10 family specifically targets mid-range applications that need high transceiver bandwidth without the power envelope of a Stratix-class device.
Key features of the 10AX115N1F45E1SG include integrated transceivers supporting backplane and chip-to-chip serial links, hard memory controllers for DDR3/DDR4, hard PCIe Gen2/Gen3 IP blocks, variable-precision DSP blocks with hardened IEEE 754 single-precision floating point, and a 0.9 V core supply. The -1 speed grade and E1 industrial operating temperature grade (-40C to +100C) make it suitable for demanding embedded systems.
Architecturally, the device uses a 20 nm TSMC process, a core fabric of adaptive logic modules (ALMs), and dedicated hardware blocks that offload common functions such as memory interfacing, PCIe, and DSP from soft logic. This is why Arria 10 GX achieves substantially higher effective throughput per watt than older 28 nm or 40 nm FPGA generations.
Typical applications include high-performance DSP (radar, beamforming, test and measurement), 100G/40G packet processing and switching, video broadcast infrastructure, medical imaging accelerators, and defense signal intelligence platforms. The wide transceiver bandwidth also makes it a popular choice for high-speed data acquisition and protocol bridging.
When designing with this part, pay close attention to PCB layout: the 1932-ball FCBGA requires high-density escape routing, microvia stacks, and controlled-impedance differential pairs for the transceivers. Power delivery must support simultaneous load steps on 0.9 V core rails - use a multi-phase controller with sufficient bulk decoupling.
This page synthesizes distributor pricing, drop-in same-footprint alternatives from the Arria 10 family, and practical design notes not assembled in the manufacturer datasheet alone.
Drop-in-Alternativen für 10AX115N1F45E1SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX115N1F45E1SG (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Mounting Type, Embedded Memory, Temperature Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX090U2F45E2SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5995 / Stück
Datenblatt ansehen →10AX115N1F45E1SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 67.7 Mbit (M20K blocks) |
| User I/O Count | 768 |
| Hard Memory Controllers | Yes (DDR3/DDR4) |
| Hard PCIe Blocks | Yes (Gen2/Gen3) |
| DSP Blocks | Yes, variable-precision with hardened FP |
| Process Technology | 20 nm |
| Core Supply Voltage | 0.9 V |
| Speed Grade | -1 |
| Temperature Grade | E1 (Industrial) |
| Gehäuse | 1932-ball FCBGA (F45) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
10AX115N1F45E1SG 1932-ball fcbga (f45) Pinbelegungsleitfaden
Pinbelegung für 10AX115N1F45E1SG (1932-ball fcbga (f45)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX115N1F45E1SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX115N1F45E1SG ist geeignet für 6 Anwendungs: High-Performance DSP / Radar Signal Processing, 100G / 40G Packet Processing and Switching, Test and Measurement Instrumentation, Medical Imaging Accelerator (CT / Ultrasound / MRI), Video Broadcast Infrastructure (4K/UHD Processing), Defense Signal Intelligence / Electronic Warfare.
High-Performance DSP / Radar Signal Processing
The 10AX115N1F45E1SG is well suited for radar and beamforming signal processing chains where its 1,150K logic elements and variable-precision DSP blocks with hardened IEEE 754 single-precision floating point deliver sustained multi-GFLOP throughput. The 0.9 V core and 20 nm process keep power-per-MAC low enough for airborne and ground-mobile radar enclosures. The integrated transceivers aggregate multiple A/D converter lanes directly into the FPGA, eliminating an external serializer. Designers typically pair this FPGA with dual DDR4 SODIMMs running through the hard memory controllers for sample buffering.
Empfohlen
100G / 40G Packet Processing and Switching
The 10AX115N1F45E1SG is widely deployed in 100G Ethernet line cards where its 768 user I/Os and integrated 28 Gbps / 14.1 Gbps transceivers enable multiple 100G, 40G, or 10G ports from a single device. Hard PCIe Gen3 blocks connect directly to a CPU or switch ASIC, and the 67.7 Mbits of M20K memory store packet headers and lookup tables at line rate. E1 industrial temperature grade supports both top-of-rack and chassis-blade deployments. Layout must preserve length-matched differential pairs for the 25-28 Gbps serial links.
Empfohlen
Test and Measurement Instrumentation
The 10AX115N1F45E1SG drives high-end oscilloscope, logic analyzer, and arbitrary waveform generator platforms where its combination of high logic density, on-chip memory bandwidth, and fast transceivers captures and processes multi-Gsps ADC data streams in real time. Variable-precision DSP lets the FPGA perform FFTs, digital down-conversion, and trigger detection without external DSP chips. The 1932-ball FCBGA package is large enough to fan out from high-channel-count front ends without I/O starvation. Pair the FPGA with JESD204B/C ADCs through the high-speed serial links.
Empfohlen
Medical Imaging Accelerator (CT / Ultrasound / MRI)
The 10AX115N1F45E1SG accelerates image reconstruction pipelines in CT scanners, ultrasound beamformers, and MRI receivers where sustained DSP throughput and low-latency memory access are paramount. Its 67.7 Mbits of embedded M20K memory cache reconstructed slices without round-tripping to external DRAM, and the hard PCIe Gen3 block streams processed images to the host CPU at 8 GT/s. The E1 industrial temperature grade supports equipment-room thermal envelopes. Designers route LVDS pairs to ADC front ends and use the hard memory controllers for image-data DDR4 buffers.
Empfohlen
Video Broadcast Infrastructure (4K/UHD Processing)
The 10AX115N1F45E1SG powers 4K/UHD video processing, multi-viewer walls, and broadcast encoder/decoder platforms where its 1,150K logic elements sustain multi-stream HEVC/H.264 processing without external co-processors. SDI, HDMI 2.0, and DisplayPort interfaces are absorbed into the user I/Os while the transceivers carry SMPTE 2022 or SMPTE 2110 over 10G/25G Ethernet. Hard DDR4 controllers provide line buffer memory for chroma upsampling and frame-rate conversion. The industrial temperature grade supports 24/7 broadcast-rack operation.
Empfohlen
Defense Signal Intelligence / Electronic Warfare
The 10AX115N1F45E1SG is used in electronic warfare and SIGINT systems where wideband RF capture, channelization, and real-time demodulation demand very high DSP throughput and transceiver bandwidth. Its 20 nm process node balances logic density with power-per-MAC for size, weight, and power (SWaP)-constrained platforms. The 1932-ball FCBGA provides the I/O density needed to mate with multi-channel RF ADCs and DACs. Industrial E1 temperature grade accommodates the wide thermal envelope of mobile and airborne deployments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX115N1F45E1SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX115N1F40E1SG | 10AX115N1F40I1SG | 10AX115H2F34E2SG | 10AX115H1F34E1SG | 10AX090U2F45E2SG |
|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) | 1152-ball FCBGA (F34) | 1152-ball FCBGA (F34) | 1932-ball FCBGA (F45) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 (same) | 1,150,000 (same) | 1,150,000 (same) | 1,150,000 (same) | 900,000 (-22%) |
| Embedded Memory (M20K) | 67.7 Mbit | 67.7 Mbit (same) | 67.7 Mbit (same) | 67.7 Mbit (same) | 67.7 Mbit (same) | 53.4 Mbit (-21%) |
| Speed Grade | -1 | -1 (same) | -1 (same) | -2 (faster) | -1 (same) | -2 (faster) |
| Temperature Grade | E1 (Industrial -40C to +100C) | E1 (same) | I1 (Industrial wider) | E2 (Industrial) | E1 (same) | E2 (Industrial) |
| Process Node | 20 nm | 20 nm (same) | 20 nm (same) | 20 nm (same) | 20 nm (same) | 20 nm (same) |
Wichtigste Unterscheidungsmerkmale
- Maximum I/O density in the Arria 10 GX 1150K-LE family (vs. 10AX115N1F40E1SG)
- Highest logic density (1150K LE) in the F45 1932-ball FCBGA pinout (vs. 10AX090U2F45E2SG)
- Lower-tier -1 speed grade gives higher timing margin in some designs (vs. 10AX115H2F34E2SG)
Designhinweise
Estimated: the 1932-ball FCBGA of the 10AX115N1F45E1SG has a typical ball pitch of 1.0 mm and stack-up with 4-6 routing layers + 2 reference planes (full PCB escape under the BGA). Use laser-drilled microvias (8-12 mil pads, 4-6 mil drills) on the top layers, with through-via fanout on inner layers. Maintain 100-ohm differential impedance for transceiver pairs and 50-ohm single-ended for general-purpose I/O. Power planes must be unbroken under the BGA to provide a low-impedance 0.9 V core feed and to minimize inductance.
Estimated: at maximum utilization the 10AX115N1F45E1SG can draw 20-30 A on the 0.9 V core rail. Use a multi-phase buck controller (such as an ISL63xxx or LTM46xx family) with at least 4 phases, each rated for 30 A peak. Place bulk polymer capacitors (470-1000 uF) within 25 mm of the BGA, plus 22 uF ceramic + 100 nF high-frequency bypass on every package pin group. Decouple auxiliary rails (VCCIO at 1.2-3.0 V, VCCPD at 2.5 V, VCCR/VCCA at 1.0-1.2 V) per the device pin connection guidelines.
Estimated: with all logic switching at full toggle rate, the 10AX115N1F45E1SG can dissipate 25-35 W. The 1932-ball FCBGA has a junction-to-ambient theta-JA around 8-12 C/W with proper thermal via array under the package heat spreader. Drill a 6x6 grid of 0.3 mm thermal vias under the die, plated shut on the top side, to spread heat into an inner copper plane. For industrial E1 temperature range (up to +100C ambient), a heat sink or high-airflow enclosure is typically required at sustained high utilization.
Keep high-speed transceiver (28 Gbps / 14.1 Gbps) differential pairs length-matched to within 5 mils and routed on the top layer over a continuous ground plane. Avoid vias on TX/RX pairs where possible. Use AC-coupling capacitors (100 nF 0402) at the transmit pins. For the PCIe Gen3 hard IP block, route the REFCLK pair with 100-ohm differential impedance and isolate it from switching power circuitry. The Quartus Prime Signal Tap tool can verify post-layout signal integrity on critical interfaces.
Compliance-Informationen
RoHS and REACH compliance per Intel/Altera product environmental documentation. AEC-Q100 not applicable (industrial-grade FPGA, not automotive-qualified). Halogen-free status not explicitly stated in verified web data.