10CX150YF780I5G - 150K LE Cyclone 10 GX FPGA 780-FBGA | Intel
Teilenummer: 10CX150YF780I5G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $227.18 | $227,18 |
| 10 | $215 | $2.150,00 |
| 100 | $195 | $19.500,00 |
| 500 | $178 | $89.000,00 |
| 1.000 | $165 | $165.000,00 |
10CX150YF780I5G Übersicht
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device whose logic fabric, embedded memory blocks, DSP blocks, and I/O transceivers are defined by a user-programmed configuration bitstream after manufacture. Within Intel's portfolio the Cyclone family sits below Stratix in cost and power, and the GX sub-family adds multi-gigabit transceivers that enable protocols such as PCIe Gen2, 10GbE, CPRI, and JESD204B without external PHY chips. The 10CX150YF780I5G is therefore commonly used as a bridge between high-speed serial links and parallel digital processing in mid-volume designs.
Key features include 150K logic elements, 484 18x18 multipliers (or 242 27x27 multipliers) for DSP, 6.6 Mbit of embedded M20K memory, twelve 10.3125 Gbps transceivers, and hard PCIe Gen2 IP blocks. The F780 package exposes 284 general-purpose I/Os supporting LVDS, LVCMOS, SSTL, and HSTL standards with 1.0/1.2/1.5/1.8/2.5/3.0 V support. An industrial temperature grade (I5G, -40C to +100C ambient) makes the part suitable for harsh-environment deployments including factory floor, outdoor wireless, and aerospace subsystems.
Typical applications include industrial machine vision, broadcast video processing, wireless backhaul fronthaul, test and measurement, software-defined radio, and PCIe card prototyping. Designers select this device when they need Stratix-class transceivers but in a Cyclone power and price envelope.
When designing in the 10CX150YF780I5G, pay close attention to transceiver reference-clock jitter, decoupling strategy for the 0.9V core and 1.8V/3.3V auxiliary rails, and PCB stackup for the FBGA escape. Quartus Prime software is required for synthesis, place-and-route, and bitstream generation; licenses are available in the Intel FPGA Self-Service Licensing Center.
Drop-in-Alternativen für 10CX150YF780I5G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10CX150YF780I5G (gleiche Bauform und Footprint) – abweichend in Speed Grade, Package, Mounting Type, DSP Blocks, Embedded Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10CX150YF780I6G
✅ Drop-In✓ Auf Lager
$325 / Stück
Datenblatt ansehen →10CX150YF780E5G
✅ Drop-In✓ Auf Lager
$160 / Stück
Datenblatt ansehen →10CX150YF780E6G
✅ Drop-In✓ Auf Lager
$575 / Stück
Datenblatt ansehen →10CX105YF780I5G
✅ Drop-In✓ Auf Lager
$115 / Stück
Datenblatt ansehen →10CX105YF780I6G
✅ Drop-In✓ Auf Lager
$1495 / Stück
Datenblatt ansehen →10CX150YF780I5G Grenzwerte & elektrische Eigenschaften
| Series | Cyclone 10 GX |
| Logic Elements (LE) | 150,000 |
| Embedded Memory | 10,907,648 bits (approx. 6.6 Mbit M20K) |
| DSP Blocks | 242 (27x27 multiplier mode) |
| 18x18 Multipliers | 484 |
| User I/Os | 284 |
| Transceivers | 12 channels up to 10.3125 Gbps |
| Hard PCIe Gen2 IP Blocks | Yes |
| Gehäuse | 780-BBGA, FCBGA (F780) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial, I5G) |
| Supply Voltage Core | 0.9 V (with 1.8 V / 2.5 V / 3.3 V auxiliary) |
| Process Node | 20 nm (TSMC) |
| RoHS-Status | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external flash) |
| Development Tool | Intel Quartus Prime |
10CX150YF780I5G 780-bbga, fcbga (f780) Pinbelegungsleitfaden
Pinbelegung für 10CX150YF780I5G (780-bbga, fcbga (f780)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10CX150YF780I5G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10CX150YF780I5G ist geeignet für 6 Anwendungs: Industrial Machine Vision Systems, Wireless Fronthaul / Backhaul Equipment, Test and Measurement Instrumentation, Broadcast Video Processing, PCIe Card Prototyping and Acceleration, Software-Defined Radio (SDR) Platforms.
Industrial Machine Vision Systems
The 10CX150YF780I5G's 150K logic elements, 242 DSP blocks, and 12 multi-gigabit transceivers up to 10.3125 Gbps make it well suited for industrial machine vision cameras and frame grabbers. The integrated transceivers connect directly to MIPI CSI-2 deserializers or CoaXPress links over coax, while the DSP fabric performs Bayer demosaic, white balance, and edge detection at line rate. The industrial temperature grade (I5G, -40C to +100C) ensures operation on factory floors with ambient swings. The F780 780-BBGA package supports up to 284 user I/Os, sufficient to drive multiple LVDS lanes for high-resolution sensors.
Empfohlen
Wireless Fronthaul / Backhaul Equipment
The 10CX150YF780I5G supports CPRI up to 9.8 Gbps and OBSAI through its 12 integrated transceivers, making it an effective baseband processing FPGA for 4G LTE and 5G NR small-cell fronthaul and backhaul. The hard PCIe Gen2 IP blocks enable direct connection to baseband SoCs or backhaul modem cards, while the 6.6 Mbit of embedded M20K memory buffers Ethernet packets and CPRI data streams. Industrial temperature grading ensures reliable operation in outdoor radio units (RRUs/AAUs). The 150K LE capacity absorbs full PHY-layer functions including channel coding, rate matching, and IQ sample distribution.
Empfohlen
Test and Measurement Instrumentation
The 10CX150YF780I5G's combination of fast transceivers, abundant DSP blocks (242), and large logic capacity makes it a strong fit for test and measurement instruments such as protocol analyzers, oscilloscopes with serial decode, and BERT testers. The transceivers handle serial data rates up to 10.3125 Gbps for protocols like USB 3.0, SATA, PCIe Gen2, and 10GbE, while the DSP fabric performs eye-diagram analysis, jitter measurement, and protocol decoding. The 284 user I/Os connect to high-speed ADCs and DACs on the analog front end. Industrial temperature grading supports laboratory and field-deployed test gear.
Empfohlen
Broadcast Video Processing
The 10CX150YF780I5G's 150K logic elements and 484 18x18 multipliers handle real-time broadcast video processing for SDI routers, multiviewers, and video format converters. The transceivers accept and transmit SMPTE ST 424 (3G-SDI) and SMPTE ST 2081 (6G-SDI) over coax, while the DSP blocks perform scaling, deinterlacing, and color-space conversion. The 6.6 Mbit of embedded memory buffers multiple video frames, and the 284 user I/Os provide HDMI, DisplayPort, and parallel LVDS interfaces. Industrial temperature grading suits broadcast studios and outdoor OB (outside broadcast) trucks.
Empfohlen
PCIe Card Prototyping and Acceleration
With hard PCIe Gen2 IP blocks and 12 transceivers, the 10CX150YF780I5G is widely used as an FPGA accelerator card on PCIe edge-computing platforms. The hard PCIe endpoint IP eliminates soft-logic overhead, freeing DSP blocks for compute kernels like FFT, FIR filtering, and AI inference. The F780 package's 284 user I/Os allow direct attachment of DDR3/DDR4 memory and high-speed parallel peripherals. Industrial temperature grading supports edge-compute deployments in uncontrolled thermal environments. The device is supported by Intel's BSP for OpenCL and oneAPI toolchains.
Empfohlen
Software-Defined Radio (SDR) Platforms
The 10CX150YF780I5G is a strong fit for software-defined radio platforms that require flexible baseband processing and high-speed data conversion interfaces. Its 12 transceivers up to 10.3125 Gbps digitize and process RF signals directly from wideband ADCs, while the 242 DSP blocks implement channelization, modulation, and demodulation. Industrial temperature grading enables deployment in tactical and outdoor SDR enclosures. The 150K logic fabric accommodates protocol stacks for waveforms including LTE, Wi-Fi, and proprietary mesh networks. The F780 780-BBGA package's 284 user I/Os support parallel digital interfaces to RF front-end daughterboards.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10CX150YF780I5G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10CX150YF780I6G | 10CX150YF780E5G | 10CX150YF780E6G | 10CX105YF780I5G | 10CX105YF780I6G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FCBGA (F780) | 780-BBGA, FCBGA (F780) | 780-BBGA, FCBGA (F780) | 780-BBGA, FCBGA (F780) | 780-BBGA, FCBGA (F780) | 780-BBGA, FCBGA (F780) |
| Logic Elements | 150,000 | 150,000 | 150,000 | 150,000 | 105,000 | 105,000 |
| Speed Grade | -5 (I5G) | -6 (I6G, faster) | -5 (E5G, commercial temp) | -6 (E6G, commercial + faster) | -5 (I5G) | -6 (I6G, faster) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Transceivers (up to 10.3125 Gbps) | 12 | 12 | 12 | 12 | 12 | 12 |
| DSP Blocks (27x27) | 242 | 242 | 242 | 242 | 156 | 156 |
| Embedded Memory | 10,907,648 bits | 10,907,648 bits | 10,907,648 bits | 10,907,648 bits | 7,024,640 bits | 7,024,640 bits |
| User I/Os | 284 | 284 | 284 | 284 | 284 | 284 |
| Estimated Unit Price (qty 1, USD) | $227.18 | $250.00 (est.) | $210.00 (est.) | $230.00 (est.) | $165.00 (est.) | $185.00 (est.) |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade on a 150K LE Cyclone 10 GX device (vs. 10CX150YF780E5G)
- Faster speed grade available with same footprint (vs. 10CX150YF780I5G vs 10CX150YF780I6G)
- Higher logic density vs lower-tier Cyclone 10 GX parts (vs. 10CX105YF780I5G)
- Hard PCIe Gen2 IP blocks integrated on-die (vs. Lattice ECP5 LFE5UM-85F)
Designhinweise
The 10CX150YF780I5G requires multiple supply rails: 0.9V core, 1.8V/2.5V/3.3V auxiliary, and dedicated PLL/ transceiver supplies. Each transceiver channel draws up to 120 mA when active; with 12 channels the transceiver block alone can reach 1.5 A. Use a 6+ phase buck regulator with per-phase inductors of 0.47 uH minimum, and place decoupling capacitors (10 uF bulk + 0.1 uF + 1 nF) within 3 mm of each supply pin. Estimated: worst-case core + IO + transceiver power at full utilization is approximately 8-12 W, requiring thermal management with at least 4 oz copper pour on inner layers.
At 10W total power dissipation, the 780-BBGA package requires a thermal management strategy. The F780 FBGA has a junction-to-ambient thermal resistance (theta_JA) of approximately 8-12 C/W with 8-layer PCB and 4 oz copper, resulting in 80-120C junction temperature rise above ambient. Industrial-grade I5G specifies junction maximum of +100C, so adequate airflow or a heatsink is mandatory for high-utilization designs. Use the Intel FPGA PowerPlay Early Power Estimator to characterize worst-case power before PCB layout. Estimated: 10W dissipation with 10 C/W theta_JA yields 100C temperature rise above ambient.
The 780-BBGA FineLine BGA has a 1.0 mm pitch with staggered depopulation. Use a minimum of 8 PCB layers with stacked microvia-in-pad construction for the BGA breakout. Layer stackup must keep the 0.9V core plane adjacent to the GND plane to provide high-frequency decoupling. Differential transceiver pairs require 100 ohm differential impedance with intra-pair length matching of 5 mils (0.127 mm) or better. Reference clock traces to the FPGA must be length-matched to within 25 mils and routed over continuous GND reference planes to minimize jitter.
Do not leave transceiver channels unterminated - unused transceiver channels must be powered down via the Quartus Prime device configuration or they will draw excessive quiescent current. Configuration pins (nCONFIG, nSTATUS, CONF_DONE) require external 10 kohm pull-up resistors to 3.3V. SRAM-based configuration means the bitstream must be loaded from external flash on every power-up - select a QSPI flash with at least 64 Mbit capacity for typical designs. AS configuration mode is recommended for production to enable field updates via JTAG-over-USB.
For multi-gigabit transceivers running at 10.3125 Gbps, use a 12-layer PCB stackup with Megtron-6 or equivalent low-loss dielectric. AC-coupling capacitors (0.1 uF) must be placed between the FPGA and the external transceiver partner, with via stubs minimized through back-drilling. Transmitter pre-emphasis and receiver equalization settings should be tuned using the Intel Transceiver Toolkit; default settings rarely achieve optimal eye opening. Maintain 90 ohm differential impedance for transceiver pairs and 100 ohm for PCIe lanes.
Compliance-Informationen
RoHS and REACH compliant per Intel material declaration. The I5G industrial temperature grade is qualified to -40C to +100C ambient, but is NOT AEC-Q100 automotive qualified. For automotive designs, use the dedicated Cyclone 10 GX automotive ordering codes. Halogen-free mold compound and lead-free BGA balls used.
