10CX150YF780E5G - Cyclone 10 GX FPGA 150K LE | Intel | 780-FBGA
MPN: 10CX150YF780E5G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $229.22 | $229.22 |
| 10 | $215 | $2,150.00 |
| 100 | $195 | $19,500.00 |
| 500 | $175 | $87,500.00 |
| 1,000 | $160 | $160,000.00 |
Drop-in alternatives for 10CX150YF780E5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10CX150YF780E6G
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View Datasheet →10CX150YF780E5G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 GX |
| Logic Elements | 150,000 |
| Embedded Memory (bits) | 10,907,648 |
| User I/Os | 284 |
| Package | 780-BBGA, FCBGA |
| Speed Grade | -5 (E5G) |
| Operating Temperature | 0C to +85C (Commercial) |
| Process Technology | 20 nm |
| Transceiver Data Rate | Up to 12.5 Gbps |
| PCI Express Hard IP | PCIe Gen2 x4 |
| DSP Blocks | Variable-precision |
| Memory Interface Support | DDR3, DDR3L, LPDDR3, QDRII+, RLDRAM3 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10CX150YF780E5G 780-bbga, fcbga Pin Configuration Guide
Complete pinout information for 10CX150YF780E5G (780-bbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX150YF780E5G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CX150YF780E5G is suitable for 6 applications: Industrial Machine Vision, Broadcast Video Processing, Video Surveillance Infrastructure, PCI Express Add-In Cards, Protocol Bridging and Interface Conversion, Test and Measurement Equipment.
Industrial Machine Vision
The 10CX150YF780E5G suits industrial machine vision systems requiring high-bandwidth sensor aggregation. Its 12.5 Gbps transceivers support MIPI CSI-2, CoaXPress, or GigE Vision aggregation across multiple cameras, while 150K logic elements handle image preprocessing pipelines including Bayer demosaicing, color space conversion, and defect detection. The 10.9 Mbits embedded memory serves as line buffers and intermediate frame storage, reducing external SDRAM accesses. Compared to ASSP alternatives, the FPGA enables custom vision algorithms that differentiate machine builders' intellectual property. Designers typically place DDR3 memory beside the FCBGA and route high-speed sensor lanes with length-matched differential pairs on the PCB top layer for SI compliance.
Recommended
Broadcast Video Processing
Broadcast studios use the 10CX150YF780E5G for video format conversion, scaling, and overlay composition between SDI inputs and HDMI or DisplayPort outputs. The transceiver tiles support SDI rates from HD-SDI through 6G-SDI without external serializer chips, reducing BOM cost. 150K logic elements handle color matrix conversion, alpha blending, and genlocking logic. The variable-precision DSP blocks accelerate chroma upsampling and noise reduction. Compared to dedicated broadcast ASICs, the FPGA allows format support updates as new standards emerge, protecting long-term product investment. Power dissipation typically falls in the 8-12W range with transceiver utilization, manageable with the FCBGA's thermal pad and chassis airflow.
Recommended
Video Surveillance Infrastructure
Network video recorder (NVR) backplanes and surveillance aggregation switches integrate the 10CX150YF780E5G to bridge IP camera streams with storage and display subsystems. The hardened PCI Express Gen2 x4 IP provides a clean interface to host CPUs, while the 12.5 Gbps transceivers enable 10GbE uplink aggregation. 284 user I/Os connect to peripheral components including SATA controllers for HDD arrays, audio codecs, and front-panel displays. The 150K logic elements support on-chip video analytics like motion detection and tampering alerts before streams reach the host CPU. Compared to multi-chip ASSP solutions, the single FPGA reduces board area and BOM cost by $20-40 per unit at volume.
Recommended
PCI Express Add-In Cards
PCI Express Gen2 x4 endpoint cards use the 10CX150YF780E5G to implement custom accelerators, protocol analyzers, or interface bridges. The hardened PCIe Gen2 IP block eliminates soft logic overhead and provides a verified, low-latency path to the host CPU. The 150K logic elements implement application-specific acceleration such as compression, encryption, or signal processing. The FCBGA package's 284 user I/Os connect to external memory, front-panel connectors, and downstream peripherals. Compared to PCIe soft IP on smaller FPGAs, the Gen2 hard IP reduces latency by 30-50% and frees logic elements for application use.
Recommended
Protocol Bridging and Interface Conversion
Industrial gateways and embedded computing modules use the 10CX150YF780E5G to bridge between incompatible protocols such as CAN, RS-485, Ethernet, USB 3.0, and legacy parallel buses. The 150K logic elements handle multiple protocol stacks simultaneously, while the transceiver tiles support high-speed serial protocols like 10GbE or multi-lane SERDES. 284 user I/Os connect to a wide mix of external PHYs, transceivers, and digital I/O. Compared to multi-chip processor+FPGA solutions, the single Cyclone 10 GX reduces BOM cost, board area, and software complexity. The Quartus Prime IP catalog provides pre-verified protocol cores that shorten development time by weeks.
Recommended
Test and Measurement Equipment
Bench-top instruments such as protocol analyzers, oscilloscopes with mixed-signal capability, and signal generators use the 10CX150YF780E5G to capture, process, and display high-speed signals. The 12.5 Gbps transceivers support direct sampling of multi-gigabit serial protocols, while the 150K logic elements implement triggering, decoding, and on-screen display generation. 10.9 Mbits of embedded memory holds deep acquisition buffers. Compared to ASIC-based instruments, the FPGA enables new protocol support through firmware updates rather than hardware redesign. Power consumption stays within typical 10-15W with active transceivers, requiring the FCBGA thermal pad to be soldered to a multi-layer PCB ground plane for heat dissipation.
Recommended
Recommended Products Summary
Engineering reference data for 10CX150YF780E5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX150YF780E6G | 10CX150YF780I5G | 10CX150YF672E5G | 10CX105YF780E5G | 10CL120YF780I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 672-BBGA, FCBGA | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same |
| Logic Elements | 150,000 | 150,000 | 150,000 | 150,000 | 105,000 | 120,000 |
| Embedded Memory (bits) | 10,907,648 | 10,907,648 | 10,907,648 | 10,907,648 | 7,024,640 | 8,011,520 |
| User I/Os | 284 | 284 | 284 | 240 | 284 | 277 |
| Speed Grade | -5 (E5G) | -6 (E6G) | -5 (I5G) | -5 (E5G) | -5 (E5G) | -7 (I7G) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | -40C to +100C (Industrial) | 0C to +85C | 0C to +85C | -40C to +100C |
| Transceiver Rate | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 6.144 Gbps |
| Family | Cyclone 10 GX | Cyclone 10 GX | Cyclone 10 GX | Cyclone 10 GX | Cyclone 10 GX | Cyclone V |
Key Differentiators
- Mid-density 150K LE Cyclone 10 GX with 12.5G transceivers (vs 10CX105YF780E5G)
- Lower power consumption than higher-tier Cyclone 10 GX (vs 10CX220YF780E5G (220K LE))
- Modern 20nm process vs older 28nm Cyclone V (vs 10CL120YF780I7G)
Design Notes
The 780-FBGA FCBGA package has a 0.8mm or 1.0mm ball pitch (verify exact pitch in the Intel package specifications). Use a PCB stack-up with microvia technology (laser-drilled stacked microvias) and 4-6 inner ground/power reference planes. Place the FPGA's thermal pad directly over a continuous ground plane with at least 9 thermal vias (0.3mm drill, 1.0mm pitch) for heat dissipation. High-speed transceiver lanes should route on the top layer over a continuous ground plane with length-matched differential pairs within 0.13mm tolerance.
The Cyclone 10 GX 10CX150 requires multiple supply rails including core (VCC, typically 0.85V or 0.9V), auxiliary (VCCAUX, ~1.8V), I/O banks (VCCIO per bank, 1.2V-3.3V), transceiver supplies (VCCR, VCCT, ~1.0V-1.2V), and transceiver analog (VCCHIP, ~1.8V). Each rail requires local decoupling with 0.1uF and 10uF ceramic capacitors placed within 2mm of the corresponding supply pins. Use a power-on sequence controller or follow the datasheet-recommended power-up sequence to avoid latch-up.
Do not assume the 10CX150YF780E5G and 10CX150YF780I5G are interchangeable - they differ in temperature grade, and using the commercial-grade part in industrial environments will cause parametric drift and reduced reliability. Do not forget to configure unused transceiver tiles to power-down mode to reduce quiescent power by 1-2W. Always read back the configuration image checksum at startup to detect bitstream corruption before releasing downstream reset signals. Estimated: transceiver active power is 200-400 mW per lane at 10 Gbps based on Intel's PowerPlay early estimator.
Compliance Information
RoHS and REACH compliant per DigiKey listing. Halogen-free status not explicitly stated in the verified web data.
