10M02SCU324C8G - MAX 10 FPGA, 2K LE, 324-LFBGA | Intel
Teilenummer: 10M02SCU324C8G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9.02 | $9,02 |
| 10 | $8.4 | $84,00 |
| 100 | $7.6 | $760,00 |
| 500 | $6.9 | $3.450,00 |
| 1.000 | $6.2 | $6.200,00 |
10M02SCU324C8G Übersicht
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic and routing can be reconfigured after manufacture by the end user. MAX 10 specifically sits in the hierarchy of programmable logic devices: FPGA -> non-volatile FPGA -> instant-on FPGA -> low-density CPLD/FPGA hybrid, optimized for cost-sensitive bridge, control, and interface roles where traditional CPLDs are too small and high-density FPGAs are too expensive.
Key features of the 10M02SCU324C8G include 125 maximum user I/Os, integrated temperature-sensing diode, on-chip flash configuration memory, support for LVDS, LVCMOS, SSTL, and other single-ended/differential I/O standards, and dual internal PLLs. The device consumes a fraction of the power of high-density FPGAs because it does not require external configuration memory and avoids the boot latency of SRAM-based FPGAs.
The 10M02SCU324C8G uses a TSMC 55 nm embedded flash process. This non-volatile technology delivers instant-on functionality in under 10 ms and supports field updates through JTAG, AS, or PS configuration schemes. Embedded IP blocks (PLLs, ADC, temperature sensor) reduce BOM cost and board area versus discrete implementations.
Typical applications include industrial I/O expansion and protocol bridging, motor and stepper control front-ends, low-cost video format conversion, sensor aggregation in IoT edge nodes, and instant-on replacement of discrete 74-series glue logic. The commercial temperature grade suits indoor industrial, consumer, and prototyping environments.
When designing with this device, ensure the JTAG chain and AS configuration interface are routed with proper signal integrity. The integrated flash and hard IP blocks reduce total BOM cost but require careful Quartus Prime pin planning to avoid I/O bank voltage conflicts between 3.3 V LVCMOS and 2.5 V LVCMOS standards.
This page synthesizes distributor pricing, drop-in alternatives from the same MAX 10 family, and practical design notes that complement the manufacturer datasheet for faster board bring-up.
Drop-in-Alternativen für 10M02SCU324C8G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M02SCU324C8G (gleiche Bauform und Footprint) – abweichend in Package, Mounting Type, Configuration Memory, Embedded Memory (bits), Logic Elements (LE).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M02SCU324C8GES
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M02SCU324I7G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M02SCU324A7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M02DCU324C8G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M02SCU324I6G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M02SCU324C8G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 |
| Logic Elements (LE) | 2,000 |
| Embedded Memory (bits) | 110,592 |
| User Flash Memory (bits) | 246,000 |
| Maximum User I/Os | 125 |
| PLLs | 2 |
| On-chip ADC | Yes (12-bit, integrated) |
| Temperature Sensor | Yes (integrated) |
| Configuration Memory | Internal flash (instant-on) |
| Betriebsversorgungsspannung | 2.85 V to 3.465 V |
| Betriebstemperatur | 0 C to +85 C (commercial) |
| Gehäuse | 324-ball UBGA (U324) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Process Technology | TSMC 55 nm embedded flash |
10M02SCU324C8G 324-ball ubga (u324) Pinbelegungsleitfaden
Pinbelegung für 10M02SCU324C8G (324-ball ubga (u324)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M02SCU324C8G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M02SCU324C8G ist geeignet für 6 Anwendungs: Industrial I/O Expansion and Protocol Bridging, Motor Control and Stepper Drive Front-End, Low-Cost Video Format Conversion, IoT Edge Sensor Aggregation, Instant-On Replacement for Discrete Glue Logic, Consumer and Prototyping Development Platforms.
Industrial I/O Expansion and Protocol Bridging
The 10M02SCU324C8G is ideally suited for industrial I/O expansion modules where 125 user I/Os in a single BGA package replace dozens of discrete 74-series glue-logic ICs. Its integrated 2,000 logic elements handle UART-to-SPI, SPI-to-I2C, or parallel-to-LVDS bridges common in PLC backplanes. With on-chip flash configuration and instant-on in under 10 ms, the device boots without an external PROM, reducing BOM and board area. The 2.85 V to 3.465 V single-supply operation and integrated temperature sensor simplify thermal monitoring on the factory floor.
Empfohlen
Motor Control and Stepper Drive Front-End
In stepper and BLDC motor control, the 10M02SCU324C8G generates precise PWM waveforms, quadrature decoding, and closed-loop commutation logic in a single chip. Its two internal PLLs produce jitter-free clock trees for high-resolution PWM at 16-bit or greater, while the 12-bit integrated ADC samples current and back-EMF feedback without an external ADC. The 324-ball UBGA package keeps the device on a compact control board, and the commercial 0 C to +85 C range covers most indoor industrial drive enclosures.
Empfohlen
Low-Cost Video Format Conversion
The 10M02SCU324C8G performs simple video timing conversion, deinterlacing, or upscaling in low-cost HDMI/VGA adapter dongles where a full video processor is overkill. Its 2,000 logic elements and embedded SRAM buffer scan-line data at standard-definition resolutions, while its support for LVDS and LVCMOS I/O standards directly interfaces to HDMI PHY chips and parallel RGB LCDs. The instant-on behavior means the dongle is ready as soon as power is applied, with no boot screen flash.
Empfohlen
IoT Edge Sensor Aggregation
For IoT edge gateways, the 10M02SCU324C8G aggregates data from SPI, I2C, and UART sensors and performs local filtering before forwarding via a high-speed UART or SPI link to a host MCU. The integrated 12-bit ADC reads analog sensor channels directly, and the on-chip temperature sensor enables board-level thermal monitoring without extra components. Instant-on non-volatile configuration is critical for battery-powered or wake-from-sleep applications where a 100 ms SRAM FPGA boot delay is unacceptable.
Empfohlen
Instant-On Replacement for Discrete Glue Logic
Designers frequently replace dozens of 74HC/74AHC logic ICs with a single 10M02SCU324C8G to reduce board area, BOM cost, and BOM risk in long-lifecycle products. The 2,000 logic elements can absorb complex address decoding, bus arbitration, and reset sequencing that would otherwise require 15 to 30 discrete gates. Because the configuration is stored in internal flash, the device behaves like standard logic with no boot delay, making it transparent to downstream processors and ASICs.
Empfohlen
Consumer and Prototyping Development Platforms
The 10M02SCU324C8G is widely deployed on Intel/Altera MAX 10 FPGA development boards and educational kits because the non-volatile configuration lets students and hobbyists iterate without re-flashing an external PROM. Its commercial 0 C to +85 C temperature range is well suited to indoor use, and the 324-ball UBGA package exposes enough I/Os to drive character LCDs, keypads, RGB LEDs, and breadboard-friendly breakout headers. Quartus Prime Lite Edition is a free toolchain supporting this device, lowering the entry barrier for first-time FPGA users.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M02SCU324C8G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M02SCU324C8GES | 10M02SCU324I7G | 10M02SCU324A7G | 10M02DCU324C8G | 10M02SCU324I6G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-ball UBGA (U324) | 324-ball UBGA (U324) - same | 324-ball UBGA (U324) - same | 324-ball UBGA (U324) - same | 324-ball UBGA (U324) - same | 324-ball UBGA (U324) - same |
| Logic Elements | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 |
| Embedded Memory (bits) | 110,592 | 110,592 | 110,592 | 110,592 | 110,592 | 110,592 |
| Maximum User I/Os | 125 | 125 | 125 | 125 | 125 | 125 |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) |
| Supply Voltage | 2.85 V to 3.465 V | 2.85 V to 3.465 V | 2.85 V to 3.465 V | 2.85 V to 3.465 V | 2.85 V to 3.465 V | 2.85 V to 3.465 V |
| On-chip ADC | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) |
Wichtigste Unterscheidungsmerkmale
- Lower cost at qty 1000 than industrial temperature variant (vs. 10M02SCU324I7G)
- Faster speed grade than A7 variant at comparable price (vs. 10M02SCU324A7G)
- Same package as 10M02DCU324C8G with single-image boot flow (vs. 10M02DCU324C8G)
Designhinweise
The 324-ball UBGA package requires a 4-layer PCB minimum with microvia stack-ups or 6 layers with dog-bone fanout to break out the 0.8 mm pitch BGA. Decoupling: place one 100 nF X7R 0402 capacitor per VCCIO and VCCINT pin pair within 2 mm of the package balls. Add four 4.7 uF bulk capacitors distributed around the package perimeter to handle inrush during configuration flash reads, per Intel MAX 10 hardware design guidelines.
For LVDS outputs above 200 Mbps, route the LVDS pairs as 100 ohm differential traces with length matching within 150 mils. Use the dedicated PLL outputs to clock high-speed interfaces and avoid using regular GPIO clock trees for DDR or SDR data, since jitter exceeds LVDS specifications. Per Intel AN 571, the I/O banks closest to the PLL outputs should be used for high-speed LVDS channels to minimize trace length.
Do not leave the nCONFIG or nSTATUS pins floating; they require a 4.7 kohm pull-up to VCCIO_3V3 for proper configuration startup. The JTAG TCK pin must also be pulled low or high during normal operation to prevent accidental boundary-scan access. The configuration flash must be erased before re-programming via JTAG if the previous image was written through Active Serial, otherwise the AS controller may lock out JTAG access per the MAX 10 Configuration User Guide.
Although the MAX 10 family is fabricated on 55 nm embedded flash, sustained high-utilization designs with all 125 I/Os switching at full speed can dissipate up to 1.5 W, raising junction temperature above the 0 C to +85 C commercial limit without copper cooling. Use at least a 50 mm x 50 mm 4-layer PCB with a continuous inner ground plane; for enclosed industrial enclosures, add 5 mm x 5 mm thermal vias under the exposed pad ball array. Estimated: 1.5 W into 30 C/W theta_JA = 45 C rise above ambient, exceeding the commercial limit at 40 C ambient - derating required.
Compliance-Informationen
RoHS and REACH compliance per Intel/Altera product declaration. Not AEC-Q100 qualified - this is a commercial-grade FPGA, not an automotive-grade part.
