10M16DCF256C8G - MAX 10 FPGA 16K LE 256-FBGA | Intel / Altera
MPN: 10M16DCF256C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $39.5 | $39.50 |
| 10 | $36.8 | $368.00 |
| 100 | $32.4 | $3,240.00 |
| 500 | $28.9 | $14,450.00 |
| 1,000 | $25.6 | $25,600.00 |
Drop-in alternatives for 10M16DCF256C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10M16DCF256A7G
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View Datasheet →10M16DCF256I7G
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View Datasheet →10M25DCF256C8G
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View Datasheet →10M08DCF256C8G
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View Datasheet →10M16DAF256C7G
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View Datasheet →10M16DCF256C8G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Part Number | 10M16DCF256C8G |
| Logic Elements (LE) | 16,000 |
| Maximum User I/O | 178 |
| Embedded SRAM (bits) | 562,176 |
| User Flash (bits) | 5,140,608 |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Package | 256-ball FineLine BGA (F256) |
| Package Size | 17 x 17 mm |
| Speed Grade | C8 (commercial) |
| Configuration Type | Dual-configuration (DC) flash, non-volatile |
| Operating Temperature | 0 °C to 85 °C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10M16DCF256C8G 17 x 17 mm Pin Configuration Guide
Complete pinout information for 10M16DCF256C8G (17 x 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16DCF256C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16DCF256C8G is suitable for 6 applications: Industrial Motor Control Front-End, Protocol Bridging and I/O Expansion, Video and Image Processing Pre-Processor, Automotive Infotainment Auxiliary Controller, Portable Medical Device Controller, IoT Edge Gateway and Sensor Aggregator.
Industrial Motor Control Front-End
The 10M16DCF256C8G is well matched to industrial motor-control front-end designs requiring fast encoder decoding, multi-axis PID loops, and field-oriented control (FOC) pre-processing. The 16,000 logic elements provide headroom for 3-axis encoder quadrature decoders running at 20 MHz plus SPI/SSI interface logic to digital signal processors or ARM Cortex controllers, while the 562 Kbit embedded SRAM (M9K blocks) buffers current-loop sample streams without external memory. Its 178 user I/O accommodates the 24 GPIO per axis (PWM, enable, fault, brake) plus RS-485, CAN, and UART links typical in servo drives. The non-volatile flash configuration enables instant-on startup within 200 µs of power-rail ramp, eliminating boot-time latency that could cause motor-controller commutation glitches. Industrial users benefit from the device's 0 to 85 °C commercial temperature range and Intel's 10-year longevity commitment.
Recommended
Protocol Bridging and I/O Expansion
The 10M16DCF256C8G serves as an ideal protocol bridge between legacy industrial buses (RS-232, RS-485, I2C, SPI) and modern interfaces (Gigabit Ethernet, USB 3.0, PCIe) inside factory automation gateways. Its 16,000 logic elements support multiple soft IP cores simultaneously (NIOS II processor, UART, I2C master, SPI slave), while 178 user I/O accommodate up to 12 simultaneous serial ports plus a parallel memory bus. The 562 Kbit on-chip SRAM provides packet buffering for store-and-forward protocol conversion at line rates up to 115.2 kbps per UART. The non-volatile dual-configuration flash allows remote firmware A/B upgrades with fail-safe rollback, critical for unattended factory-floor equipment where service calls are expensive. Instant-on power-up suits time-sensitive PLC scan-cycle requirements.
Recommended
Video and Image Processing Pre-Processor
The 10M16DCF256C8G fits video and image pre-processing pipelines such as camera-link front-ends, machine-vision frame grabbers, and surveillance DVR multiplexer boards. Its 562 Kbit embedded SRAM implements line buffers for up to 1024-pixel-wide video streams at 60 Hz without external DDR memory, reducing board cost and EMI. The 178 user I/O accept multiple CMOS camera parallel data buses plus HDMI/DVI output links, while the 16,000 logic elements process Bayer-to-RGB conversion, gamma correction, and edge-detection algorithms at typical 100 MHz pixel clock. The 256-ball FineLine BGA package is footprint-compatible with higher-density MAX 10 family members, allowing PCB reuse from low-resolution to high-resolution designs. Intel's Quartus Prime toolchain provides validated IP for common video functions including de-interlacing and frame-rate conversion.
Recommended
Automotive Infotainment Auxiliary Controller
The 10M16DCF256C8G (and its automotive-grade counterpart 10M16DAF256A7G) suits automotive infotainment auxiliary controllers such as head-unit display drivers, instrument-cluster back-end controllers, and rear-seat entertainment hubs. The 16,000 logic elements implement LVDS display serializers, touch-screen I2C controllers, and audio I2S bridges, while the 562 Kbit embedded SRAM buffers graphics overlay frames and audio sample streams. The 178 user I/O connect to MIPI-DSI display panels, CAN-FD vehicle bus, and Ethernet AVB networks. Non-volatile flash configuration enables instant-on dashboard startup within boot-time budgets of automotive OEMs. For AEC-Q100 qualified applications, designers should select the 'A' suffix variants (10M16DAF256A7G) in the same 256-ball FineLine BGA package; the commercial 10M16DCF256C8G is suitable for non-safety automotive applications such as rear-seat displays.
Recommended
Portable Medical Device Controller
The 10M16DCF256C8G fits portable medical-device controller boards such as patient-monitor front-ends, infusion-pump controllers, and pulse-oximeter signal-conditioning modules. The integrated ADC option available on 10M16DA-family variants provides up to 12-bit 1 MSPS analog sampling for ECG, EEG, and SpO2 sensor aggregation without an external ADC chip, saving board area and BOM cost. The 16,000 logic elements implement real-time DSP filters, alarm logic, and LCD driver interfaces, while 178 user I/O accommodate multiple sensor channels plus USB, Bluetooth, and Wi-Fi module connections. Non-volatile dual-configuration flash supports FDA-compliant field firmware updates with fail-safe rollback. The 256-ball FineLine BGA in 17 x 17 mm suits compact handheld form factors, and Intel's 10-year longevity commitment aligns with medical-device lifecycle requirements.
Recommended
IoT Edge Gateway and Sensor Aggregator
The 10M16DCF256C8G is well matched to IoT edge gateway designs aggregating multiple sensor interfaces (SPI, I2C, UART, one-wire) and pre-processing data before forwarding to cloud backhaul via Ethernet or cellular modules. Its 16,000 logic elements implement a NIOS II soft-core processor plus multiple serial-interface controllers, while 562 Kbit embedded SRAM buffers time-series data prior to MQTT or CoAP transmission. The 178 user I/O accept up to 24 simultaneous SPI sensor buses plus GPIO expansion headers, and the 5 Mbit user flash can store device certificates, calibration constants, and small data logs. Non-volatile dual-configuration flash enables secure OTA firmware upgrades with rollback to known-good image, critical for unattended edge installations. Instant-on power-up suits battery-powered sensors with wake-from-hibernate cycles.
Recommended
Recommended Products Summary
Engineering reference data for 10M16DCF256C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16DCF256A7G | 10M16DCF256I7G | 10M25DCF256C8G | 10M08DCF256C8G | 10M16DAF256C7G |
|---|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (F256) | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 16,000 | 16,000 | 16,000 | 25,000 | 8,000 | 16,000 |
| Embedded SRAM (bits) | 562,176 | 562,176 | 562,176 | 675,840 | 387,072 | 562,176 |
| Configuration Type | Dual-configuration flash (DC) | Dual-configuration flash (DC) | Dual-configuration flash (DC) | Dual-configuration flash (DC) | Dual-configuration flash (DC) | Single-configuration flash (SC) |
| Integrated ADC | No | No | No | No | No | Yes (12-bit 1 MSPS) |
| Speed Grade | C8 (commercial) | A7 (industrial) | I7 (industrial) | C8 (commercial) | C8 (commercial) | C7 (commercial) |
| Operating Temperature | 0 to +85 C (commercial) | -40 to +100 C (automotive) | -40 to +100 C (industrial) | 0 to +85 C (commercial) | 0 to +85 C (commercial) | 0 to +85 C (commercial) |
| Approx. Unit Price (qty 1) | $39.50 | $44.00 | $43.50 | $55.00 | $28.00 | $42.00 |
Key Differentiators
- Non-volatile on-chip flash eliminates external boot PROM (vs 10M08DCF256C8G (and other SRAM-based FPGAs such as Cyclone IV EP4CE10))
- 16,000 logic elements in 256-ball FineLine BGA is highest-density C8 commercial variant in MAX 10 family (vs 10M08DCF256C8G)
- Pin-compatible upgrade path to 10M25DCF256C8G and 10M16DAF256C7G variants (vs 10M25DCF256C8G (logic upgrade), 10M16DAF256C7G (ADC option))
Design Notes
The 256-ball FineLine BGA package uses a 1.0 mm ball pitch on a 17 x 17 mm body, requiring at least 4 PCB layers with a dedicated ground plane beneath the BGA footprint. According to the Intel MAX 10 hardware design guidelines, escape routing should use 0.1 mm (4 mil) trace-and-space with microvia-in-pad or dog-bone fanout to inner signal layers. Place at least eight 0.1 µF and four 10 µF decoupling capacitors within 10 mm of the package power balls to maintain signal integrity on the 178 user I/O switching at typical 100 MHz LVCMOS rates. Keep the 1.2 V core supply LDO or DC-DC regulator within 25 mm of the package with a wide 0.5 mm power trace to limit IR drop.
The MAX 10 family requires three independent power rails: 1.2 V VCCINT (core), 2.5 V or 3.3 V VCCA (analog/PLL), and 1.8 V to 3.3 V VCCIO (I/O banks). According to the Intel MAX 10 datasheet, VCCINT core current can reach 500 mA during configuration flash programming, requiring a 1 A-rated LDO or DC-DC regulator. Power-rail sequencing must enforce VCCINT before VCCIO to avoid I/O latch-up; Intel's MAX 10 power management reference designs recommend a dedicated power-sequencer IC or an RC network on the LDO enable pin. Add at least one bulk 47 µF tantalum capacitor per rail plus 0.1 µF and 10 nF ceramic decoupling in parallel near each BGA power pin cluster.
A common design pitfall with the MAX 10 family is forgetting that the dual-configuration (DC) flash variant stores two images but only one is active at power-up; switching images requires explicit JTAG or remote-trigger logic via the CONFIG_SEL pin. According to the Intel MAX 10 configuration user guide, image-switch latency is approximately 100 ms plus reconfiguration time, so mission-critical designs must hold downstream logic in reset during the switch. Another common mistake is treating the MAX 10 like a Cyclone IV and routing configuration pins as GPIO without consulting the dual-purpose pin assignments; the MSEL, nCONFIG, nSTATUS, CONF_DONE, and JTAG pins have dedicated pull-up/down requirements that must be respected for reliable boot. Always validate your pin assignments against the Quartus Prime fitter-generated .pin file before PCB fabrication.
Compliance Information
RoHS and REACH compliant per Intel product materials declaration. Lead-free BGA uses SAC305 alloy. Commercial temperature grade is not AEC-Q100 qualified; for automotive applications select the 10M16DCF256A7G variant which is AEC-Q100 Grade 2 qualified.
